10118615-436021

Headers, Male Pins Overview

The Amphenol ICC (FCI) 10118615-4361 is a vertical header connector featuring 36 positions with a 2.54mm pitch. It utilizes through-hole termination and square pin contacts with gold plating. The housing is constructed from polyester reinforced with glass fiber, rated UL94 V-0 for flammability. Designed for board-to-board applications, it supports a mating height of 0.420 inches and includes a shroud for alignment.

Headers, Male Pins Feature Summary

• Vertical orientation for space-efficient mounting
• Gold-plated contacts for reliable signal transmission
• Shrouded design for precise alignment

Headers, Male Pins Applications

• Industrial control systems
• Telecommunications equipment
• Consumer electronics assemblies

Headers, Male Pins Procurement Notes

Verify the exact suffix against official datasheets to confirm contact configuration and material specifications. Ensure compatibility with mating receptacles regarding pitch and shroud type. Confirm RoHS compliance status for specific regional regulatory requirements before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when a high-density vertical interconnect is required. The 2.54mm pitch accommodates standard PCB layouts. Verify that the operating temperature range aligns with the application environment. Consider the mechanical stability provided by the through-hole mounting style for robust connections.

Headers, Male Pins Part Context

This part belongs to the FCI connector portfolio, now integrated into Amphenol ICC. It serves as a standard interconnect solution within the broader family of rectangular connectors. The product line emphasizes signal integrity and durability for commercial electronic markets.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 36-position count, 2.54mm pitch, and vertical form factor. Verify identical shroud configurations and contact plating thicknesses to ensure functional interchangeability without redesigning the host PCB.