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Product Detailed Parameters
- Description：CONN EDGE DUAL MALE 60POS 0.100
- Series：HPCE®
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Card Type：Non Specified - Dual Edge
- Gender：Male
- Number of Positions/Bay/Row：-
- Number of Positions：60 (24 + 36 Power)
- Card Thickness：-
- Number of Rows：2
- Pitch：0.100" (2.54mm)
- Read Out：Dual
- Features：Board Lock, Mating Guide
- Mounting Type：Through Hole, Right Angle
- Termination：Solder
- Contact Material：Copper Alloy
- Contact Finish：Gold or Gold, GXT™
- Contact Finish Thickness：-
- Contact Type：-
- Color：Black
- Flange Feature：-
- Operating Temperature：-55°C ~ 105°C
Download product information
Overview
The Amphenol ICC (FCI) part number 10119040-11000LF is a dual-edge card edge connector designed for high-performance computing applications. It features a male gender configuration with 60 positions arranged in a single row. The connector utilizes a 0.100-inch (2.54mm) pitch and is constructed to accommodate non-specified dual-edge cards. This component is part of the HPCE series, indicating its suitability for demanding signal integrity and power distribution requirements within server and storage architectures.
Feature Summary
- Dual-edge male contact configuration for secure board retention
- High-density 60-position layout optimized for space-constrained designs
- HPCE series construction supporting robust mechanical stability
Applications
- Server backplane interconnects
- Storage array module connections
- High-performance computing hardware interfaces
Procurement Notes
Verify the specific suffix and material specifications against the official datasheet to ensure compatibility with your PCB design and environmental requirements. Confirm that the dual-edge male configuration matches your system's mechanical constraints. Check for any recent product change notices or material updates issued by Amphenol ICC prior to finalizing procurement orders.
Selection Notes
Select this connector when a dual-edge interface is required for high-density signal routing. Ensure the PCB stack-up supports the 0.100-inch pitch and that the mating card thickness aligns with standard dual-edge specifications. Consider the HPCE series characteristics for applications requiring enhanced durability and reliable electrical performance in enterprise environments.
Part Context
This component belongs to the HPCE (High Performance Computing Edge) series from Amphenol ICC. The series is engineered for next-generation data center and enterprise systems, focusing on improved signal integrity, thermal management, and mechanical reliability compared to standard card edge connectors.
Replacement Considerations
No public confirmed substitute part numbers are available in the provided documentation. Verify compatibility with existing tooling and mating components before considering alternative sources.
