10119472-002LF

Overview

The Amphenol ICC (FCI) 10119472-002LF is a dual-edge card edge connector designed for through-hole mounting. It features a 28-position configuration, comprising 20 signal and 8 power contacts. The connector utilizes female cantilever contacts with gold or GXT™ plating to ensure reliable electrical performance. Constructed with a black thermoplastic housing, it supports non-specified double-sided cards with a thickness of 0.062 inches (1.57mm). The component operates within a temperature range of -55°C to 105°C and includes board lock features for secure installation.

Feature Summary

• Dual-edge design accommodating both signal and power circuits in a single interface
• Cantilever contact system ensures stable connection with double-sided cards
• Board lock mechanism provides secure mechanical retention during operation
• Gold or GXT™ contact finish offers corrosion resistance and low contact impedance

Applications

• High-performance computing systems requiring robust card-to-board interfaces
• Industrial control modules utilizing double-sided circuit boards
• Telecommunications infrastructure equipment needing reliable signal transmission
• Server backplane connections for data center applications

Procurement Notes

Verify the specific contact plating specification, as options include standard gold or GXT™ variants which may have distinct material properties. Confirm that the target application utilizes double-sided PCBs compatible with the 0.062-inch thickness requirement. Ensure the ordering suffix matches the desired termination and packaging configuration. Cross-reference the latest datasheet for any recent product change notifications affecting pinout or mechanical dimensions before finalizing procurement.

Selection Notes

Select this connector when a high-density interface is required for double-sided cards with mixed signal and power requirements. The 28-position layout balances space efficiency with adequate power distribution capabilities. Consider the through-hole termination method for applications prioritizing mechanical strength over surface mount constraints. Evaluate the operating temperature range against environmental conditions to ensure reliability under thermal stress.

Part Context

This component belongs to the HPCE® series from Amphenol ICC (FCI), focusing on high-density interconnect solutions. The 10119472-002LF variant specifically addresses the need for durable connections in demanding electronic environments. Its design aligns with industry standards for card edge connectors, providing a standardized footprint for integration into larger assembly architectures.

Replacement Considerations

Direct substitutes must match the 28-position count, dual-edge configuration, and through-hole termination. Verify compatibility with 0.062-inch card thickness and identical pin spacing. Alternative parts should offer similar current ratings and temperature specifications to maintain system integrity without redesigning the PCB layout.