10119536-21000LF

Overview

The Amphenol ICC (FCI) part number 10119536-21000LF is a card edge connector designed for high-performance computing environments. It features a male contact configuration with 60 positions, arranged in a dual row layout. The connector utilizes gold or GXT™ plating on copper alloy contacts to ensure reliable signal integrity and low contact resistance. Constructed with a thermoplastic insulator, the unit is rated for operation within a temperature range of -55°C to +105°C. It is engineered to mate with female edgecards and includes board lock features for secure mechanical retention during system operation.

Feature Summary

• Dual-row male contact design for high-density interconnect applications
• Gold or GXT™ plated copper alloy contacts for enhanced conductivity
• Integrated board lock mechanism for secure mounting stability

Applications

• High-performance computing systems
• Server backplane interconnects
• Industrial control boards requiring robust power and signal connections

Procurement Notes

Verify that the specific ordering suffix matches the required contact plating specification, as variations may exist between standard gold and GXT™ finishes. Confirm the package quantity aligns with production requirements, noting that distributor listings may vary by region. Ensure compatibility with the mating female edgecard thickness and pitch specifications before finalizing procurement orders to prevent assembly mismatches.

Selection Notes

Select this component when a high-density, dual-row male connector is required for vertical board-to-board or edge-card interfaces. The choice depends on the need for durable gold-based plating solutions in demanding thermal environments. Consider the physical dimensions and locking mechanisms to ensure proper fit within the designated chassis space and mating constraints.

Part Context

This component belongs to the HPCE® series from Amphenol ICC (FCI), a product line specialized for high-performance computing and enterprise infrastructure. The series focuses on delivering superior signal integrity and power delivery capabilities through advanced material science and precision engineering, supporting the growing data throughput demands of modern server architectures.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify cross-reference availability directly with the manufacturer or authorized distributors, ensuring that any alternative maintains identical pin count, row configuration, and contact plating specifications.