10121505-000812DLF

10121505-000812DLF

$4.32
  • Description:CONN EDGE DUAL FMALE 20POS GOLD
  • Series:HPCE®
  • Mfr:Amphenol ICC (FCI)
  • Package:Tray

SKU:452f2fa5b2b0 Category: Brand:

  
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Product Detailed Parameters

  • Description:CONN EDGE DUAL FMALE 20POS GOLD
  • Series:HPCE®
  • Mfr:Amphenol ICC (FCI)
  • Package:Tray
  • Card Type:Non Specified - Dual Edge
  • Gender:Female
  • Number of Positions/Bay/Row:4; 6
  • Number of Positions:20 (12 + 8 Power)
  • Card Thickness:0.062" (1.57mm)
  • Number of Rows:2
  • Pitch:-
  • Read Out:Dual
  • Features:Board Lock
  • Mounting Type:Through Hole
  • Termination:Press-Fit
  • Contact Material:Copper Alloy
  • Contact Finish:Gold or Gold, GXT™
  • Contact Finish Thickness:-
  • Contact Type:-
  • Color:Black
  • Flange Feature:-
  • Operating Temperature:-55°C ~ 105°C

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10121505-000812DLF

Overview

The Amphenol ICC (FCI) 10121505-000812DLF is a standard card edge connector from the HPCE® series. It features a dual-edge female configuration with 20 total positions, arranged as 4 signal and 6 power contacts per bay across two rows. The connector utilizes a press-fit termination method for vertical mounting on printed circuit boards. It employs gold or GXT™ plated copper alloy contacts housed in black thermoplastic insulation. Designed for non-specified dual-edge cards with a thickness of 0.062 inches (1.57mm), it operates within a temperature range of -55°C to +105°C.

Feature Summary

  • Dual-edge female contact configuration supporting mixed signal and power routing
  • Press-fit termination mechanism ensures secure vertical board attachment
  • Gold or GXT™ surface plating on copper alloy contacts for reliable conductivity
  • Integrated board lock feature provides mechanical stability during mating

Applications

  • High-performance computing backplanes
  • Telecommunications infrastructure equipment
  • Industrial control system interconnects
  • Data processing hardware modules

Procurement Notes

Verify the specific ordering suffix against the official datasheet to confirm contact plating specifications and material composition. Ensure compatibility with the target PCB stack-up and card thickness requirements before procurement. Confirm that the selected variant meets all necessary environmental certifications and RoHS compliance standards required for the intended application environment.

Selection Notes

Select this component when a robust vertical interconnect solution is required for dual-edge card applications. The HPCE series offers high reliability for demanding environments. Consider the press-fit installation profile for automated assembly processes. Evaluate the thermal performance limits relative to the operational duty cycle of the host system to ensure long-term durability under varying temperature conditions.

Part Context

This connector belongs to the HPCE® product line by Amphenol ICC (FCI), specializing in high-density interconnect solutions. The HPCE series is engineered for high-speed data transmission and power delivery in compact form factors. As part of the broader portfolio acquired by Amphenol, these connectors support advanced signal integrity requirements for modern electronic systems requiring durable and precise board-to-board connections.

Replacement Considerations

Consult the official cross-reference documentation for verified substitute part numbers. Ensure any replacement maintains identical pin count, pitch, and termination style. Verify mechanical footprint compatibility and electrical rating equivalence before substituting.

10121505-000812DLF10121505-000812DLF
$4.32
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