10121505-320424CLF

$6.30

Description：CONN EDGE DUAL FMALE 60POS GOLD
Series：HPCE®
Mfr：Amphenol ICC (FCI)
Package：Tray

SKU:c69ae8688580 Category: Edgeboard Connectors Brand: Amphenol ICC (FCI)

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Product introduction

Product Detailed Parameters

Description：CONN EDGE DUAL FMALE 60POS GOLD
Series：HPCE®
Mfr：Amphenol ICC (FCI)
Package：Tray
Card Type：Non Specified - Dual Edge
Gender：Female
Number of Positions/Bay/Row：18; 12
Number of Positions：60 (24 + 36 Power)
Card Thickness：0.062" (1.57mm)
Number of Rows：2
Pitch：-
Read Out：Dual
Features：Board Lock
Mounting Type：Through Hole
Termination：Press-Fit
Contact Material：Copper Alloy
Contact Finish：Gold or Gold, GXT™
Contact Finish Thickness：-
Contact Type：-
Color：Black
Flange Feature：-
Operating Temperature：-55°C ~ 105°C

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10121505-320424CLF

Overview

The Amphenol ICC (FCI) 10121505-320424CLF is a standard card edge connector from the HPCE® series. It features a dual female configuration with 60 positions, comprising 24 signal and 36 power contacts. The connector utilizes a press-fit termination method for vertical installation on printed circuit boards. Contact surfaces are finished with gold or GXT™ plating over copper alloy substrates. Designed for high-performance computing environments, it accommodates board thicknesses of 0.062 inches (1.57mm).

Feature Summary

High-density power and signal integration within a single dual-edge receptacle design.
Robust press-fit termination ensures reliable mechanical anchoring without soldering.
Gold or GXT™ contact plating provides durable conductivity and corrosion resistance.
Thermoplastic housing offers structural integrity across specified industrial temperature ranges.

Applications

High-performance computing server backplanes
Data center interconnect systems
Telecommunications infrastructure equipment

Procurement Notes

Verify that the specific suffix 'CLF' corresponds to the required contact plating specification, as variants like 'DLF' may differ in finish. Confirm the lead time aligns with project schedules, as manufacturing durations vary by region. Ensure compatibility with existing board stack-up requirements regarding the 0.062-inch thickness constraint before finalizing procurement orders.

Selection Notes

Select this component when high current capacity is required alongside dense signal routing in vertical mounting scenarios. The dual-edge design maximizes pin count per unit area compared to single-edge alternatives. Evaluate thermal management needs against the -55°C to +105°C operating range. Consider the press-fit installation process for long-term reliability in vibration-prone environments.

Part Context

This part belongs to the HPCE® (High Performance Computing Edge) product line, engineered specifically for demanding data communication applications. The series emphasizes high density and robust electrical performance. It complements other FCI solutions by providing standardized interfaces for next-generation server architectures requiring efficient power distribution and signal integrity.