10121506-080010DLF

Overview

The Amphenol ICC (FCI) 10121506-080010DLF is a high-speed mezzanine connector system component designed for dense electronic assemblies. It features a 0.5mm pitch and supports data rates up to 16 Gbps per lane. The connector utilizes a gold-plated phosphor bronze contact material for reliable signal integrity. It is available in various housing configurations with options for surface mount or through-hole termination. The design incorporates shielding capabilities to minimize electromagnetic interference in compact form factors.

Feature Summary

• Supports high-speed data transmission with low insertion loss characteristics
• Utilizes precise 0.5mm pitch for dense board layout applications
• Incorporates robust shielding structures for EMI protection
• Features durable gold-plated contacts for long-term reliability

Applications

• High-performance computing server backplanes
• Storage area network interconnects
• Telecommunications base station modules
• Industrial automation control units

Procurement Notes

Verify the specific housing variant and mating partner compatibility before procurement. Confirm that the selected configuration matches the required pin count and termination style for the target PCB layout. Ensure that the shielding type aligns with the enclosure design constraints. Cross-reference the official datasheet for mechanical dimensions to guarantee proper fit within the assembly envelope.

Selection Notes

Select this component based on the required data rate specifications and spatial constraints of the application. Evaluate the necessary shielding requirements against the system's electromagnetic environment. Consider the mating connector interface to ensure mechanical alignment and electrical continuity. Review the thermal performance characteristics if the application involves significant power dissipation near the connector site.

Part Context

This part belongs to the FCI High Speed Mezzanine Connector family, engineered for demanding digital interfaces. It complements other components in the series by providing standardized interconnection solutions. The product line emphasizes miniaturization while maintaining signal quality at elevated frequencies. It serves as a critical link between circuit boards in complex multi-layer systems.

Replacement Considerations

Direct substitutes must match the 0.5mm pitch and 16 Gbps capability. Verify identical mechanical footprint and pin configuration for drop-in replacement. Ensure compatible shielding and termination methods are maintained. Consult official cross-reference lists for approved alternative part numbers from the same manufacturer.