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The Amphenol ICC (FCI) part number 10121506-162020DLF is a dual-edge female card edge connector designed for high-performance computing applications. It features a total of 56 positions, configured as 20 signal and 36 power contacts. The connector utilizes a tin-lead plating finish on the contacts and is housed in a black thermoplastic body. Designed for vertical mounting via press-fit termination, it supports board thicknesses typical of standard edge cards within the HPCE series specifications.
Verify the specific ordering suffix DLF against the manufacturer's current datasheet to confirm material composition and compliance status. Ensure that the press-fit footprint matches the target PCB design requirements. Confirm availability through authorized distributors as supply chain conditions may vary. Cross-reference the pinout diagram with system schematics to validate signal and power assignment integrity before procurement.
Select this component when a dual-edge interface is required for separating signal and power domains in high-density environments. The press-fit option is suitable for applications demanding high mechanical reliability and thermal cycling performance. Consider the 56-position count and specific 20/36 split to match system bandwidth and power distribution needs. Evaluate the tin-lead finish compatibility with assembly processes and regulatory constraints.
This connector belongs to the HPCE (High Performance Computing Edge) series by Amphenol ICC (FCI). The series is engineered for demanding computing environments where signal integrity and power delivery are critical. The 10121506 base family typically includes various configurations tailored for different position counts and termination styles, serving as a key interconnect solution in modern infrastructure hardware.
Consult official substitution lists for variants within the 10121506 family. Verify equivalent dual-edge connectors from other manufacturers only if they match the exact pin count, pitch, and press-fit mechanical dimensions. Ensure any substitute maintains the same signal-to-power ratio and housing material properties.