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The Amphenol ICC (FCI) part number 10122864-418002LF is a board-to-board connector component belonging to the Minitek product family. It features a dual-row configuration with a standard 2.00mm pitch between contacts. The assembly is designed for surface-mount termination, utilizing solder pins for secure attachment to printed circuit boards. The connector maintains a straight mounting angle orientation and incorporates tin plating on the contact surfaces to ensure reliable electrical conductivity.
Verify the specific manufacturer part number against official Amphenol FCI documentation to confirm current availability status and lead times. Ensure that the tin-plated contact finish aligns with your design requirements regarding corrosion resistance and solderability. Cross-reference the dual-row pin count and pitch specifications with your target PCB layout to guarantee mechanical compatibility before initiating procurement procedures.
Select this component when a robust, low-profile board-to-board solution is required for space-constrained designs. The 2.00mm pitch offers a balance between signal density and manufacturing ease. Consider the straight mount profile for applications where vertical clearance is limited. Validate that the tin plating meets the environmental conditions of the intended operating environment.
This component belongs to the Minitek series by Amphenol ICC (FCI), a brand known for cost-effective and durable interconnect solutions. The Minitek line focuses on providing versatile board-to-board and cable-to-board options for mass-market electronics. This specific model represents a standard through-hole or surface-mount variant designed for general industrial and commercial applications.
Direct substitutes must match the 2.00mm pitch, dual-row configuration, and straight surface-mount form factor. Verify that alternative suppliers offer identical tin-plated contacts and compatible housing materials. Ensure any replacement maintains the same pin count and overall dimensions to fit existing PCB footprints without redesign.