10122927-001LF

Overview

The Amphenol ICC (FCI) 10122927-001LF is a dual-sided edge card connector featuring 24 positions arranged in two rows of 12. It utilizes a 0.050-inch (1.27mm) pitch and is designed for board-to-board applications. The component accepts female contacts and is housed in a black casing. It supports vertical mounting on printed circuit boards, providing reliable electrical interconnection for high-density mezzanine or standard card edge interfaces.

Feature Summary

• Dual-sided configuration with 12+12 power/contact positions
• Black housing material for visual identification
• Vertical board edge mounting style
• Female contact type for secure mating

Applications

• High-density mezzanine interconnects
• Standard card edge applications
• Board-to-board connections requiring dual-row access

Procurement Notes

Verify the specific ordering suffix to ensure correct height and contact plating options match your design requirements. Confirm RoHS compliance status and lead times directly with the manufacturer or authorized distributors, as availability may vary based on production schedules and regional supply chain conditions.

Selection Notes

Select this connector when a dual-sided edge interface with a 1.27mm pitch is required. Ensure the mating card thickness and mechanical retention needs align with the HPCE series specifications. Consider the black housing for contrast against lighter PCB colors during assembly and inspection processes.

Part Context

This part belongs to the HPCE (High Performance Card Edge) series by Amphenol FCI. The series is engineered for robust performance in demanding environments, offering various height options and contact configurations to support complex electronic assemblies and high-speed data transmission requirements.

Replacement Considerations

Check for direct cross-reference part numbers from Amphenol's updated product lines. Verify that any substitute maintains the identical 24-position count, 0.050-inch pitch, and dual-sided female contact geometry to ensure mechanical and electrical compatibility without redesigning the footprint.