10123730-000016BLF

10123730-000016BLF

$2.40
  • Description:CONN EDGE DUAL FML 68POS 0.050
  • Series:HPCE®
  • Mfr:Amphenol ICC (FCI)
  • Package:Tray

SKU:e3f662ee4567 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:CONN EDGE DUAL FML 68POS 0.050
  • Series:HPCE®
  • Mfr:Amphenol ICC (FCI)
  • Package:Tray
  • Card Type:Non Specified - Dual Edge
  • Gender:Female
  • Number of Positions/Bay/Row:32
  • Number of Positions:68
  • Card Thickness:0.062" (1.57mm)
  • Number of Rows:2
  • Pitch:0.050" (1.27mm)
  • Read Out:Dual
  • Features:Board Lock
  • Mounting Type:Through Hole
  • Termination:Press-Fit
  • Contact Material:Copper Alloy
  • Contact Finish:Gold or Gold, GXT™
  • Contact Finish Thickness:-
  • Contact Type:-
  • Color:Black
  • Flange Feature:-
  • Operating Temperature:-55°C ~ 105°C

Download product information

10123730-000016BLF

Overview

The Amphenol ICC (FCI) 10123730-000016BLF is a dual-sided female edge card connector designed for high-density applications. It features 68 positions with a 0.050 inch (1.27mm) pitch, utilizing gold or GXT™ plated contacts on copper alloy terminals. The housing is black thermoplastic, and the unit supports board thicknesses of 0.062 inches (1.57mm). Rated for operation between -55°C and +105°C, it employs press-fit termination for secure through-hole mounting.

Feature Summary

  • Dual-sided female contact configuration for robust edge card engagement
  • Gold or GXT™ plating ensures reliable signal integrity and corrosion resistance
  • Press-fit termination provides mechanical stability without soldering

Applications

  • High-density pin-and-socket cable-to-board systems
  • Compact power-dense electronic applications
  • HPCE vertical type connector implementations

Procurement Notes

Verify the specific ordering suffix to confirm contact plating options and housing color variations. Ensure compatibility with the target PCB board thickness of 0.062 inches. Confirm that the press-fit termination method aligns with the assembly process capabilities. Check for RoHS compliance documentation if required by project specifications.

Selection Notes

Select this component when high-density interconnectivity is required in compact form factors. The dual-sided design maximizes I/O density within limited board space. Consider the thermal operating range and material compatibility with mating edge cards. Evaluate the press-fit installation requirements against available manufacturing equipment.

Part Context

This part belongs to the HPCE series, representing Amphenol FCI's high-performance connectivity solutions. The manufacturer, now part of Amphenol ICC, specializes in connectors supporting information and communication markets. This specific model addresses the demand for reliable connections in power-dense environments.

Replacement Considerations

Consult official Amphenol ICC substitution guides for verified alternative part numbers. Generic equivalents may not match the precise pitch, plating, or termination requirements. Verify dimensional compatibility and electrical ratings before considering any cross-reference.

10123730-000016BLF10123730-000016BLF
$2.40
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