10123908-A20LF

Overview

The Amphenol ICC (FCI) 10123908-A20LF is a high-density, board-to-board connector system designed for compact electronic assemblies. It features a vertical surface-mount configuration with a 0.5mm pitch and dual rows of contacts to maximize I/O density within limited footprint areas. The connector utilizes a gold-plated phosphor bronze contact material to ensure reliable signal transmission and low contact resistance in demanding environments. This component supports mating heights ranging from 0.6mm to 1.2mm, accommodating various PCB stack-up requirements while maintaining mechanical stability through integrated guide pins or boss holes.

Feature Summary

• High-density interconnect capability with 0.5mm pitch spacing
• Vertical surface-mount design for space-constrained applications
• Gold-plated contacts for enhanced conductivity and corrosion resistance

Applications

• Mobile communication devices requiring compact connectivity
• Portable consumer electronics with tight spatial limitations
• Industrial control modules needing reliable board-to-board links

Procurement Notes

Verify the specific housing color and keying options against the official datasheet before procurement, as these variants may differ by suffix. Confirm that the selected mate height aligns precisely with the target assembly stack-up to prevent mechanical interference. Ensure that the ordering suffix corresponds exactly to the required contact length and termination style specified in the manufacturer's documentation to avoid compatibility issues during integration.

Selection Notes

Select this connector when maximum pin density is critical within a minimal board area. Evaluate the required mating force and retention characteristics against the mechanical constraints of the host enclosure. Consider the thermal performance and current carrying capacity relative to the intended signal load. Verify that the PCB land pattern matches the exact dimensions provided in the official drawing to ensure proper solder joint formation and long-term reliability under thermal cycling conditions.

Part Context

This component belongs to the FCI high-density connector family, engineered for modern electronics where space optimization is paramount. It complements other board-to-board solutions by offering a robust mechanical interface suitable for frequent mating cycles. The series is widely utilized in industries prioritizing miniaturization without compromising electrical performance or structural integrity of the connection point.

Replacement Considerations

Direct substitutes must match the 0.5mm pitch, dual-row configuration, and vertical orientation. Verify that any alternative part offers identical mating height ranges and compatible guide pin specifications. Cross-reference the contact plating thickness and material composition to ensure equivalent electrical and environmental performance standards are maintained.