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Product Detailed Parameters
- Description：CONN HEADER SMD 60POS 1.27MM
- Series：Rib-Cage™ III
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.050" (1.27mm)
- Number of Positions：60
- Number of Rows：2
- Row Spacing - Mating：0.050" (1.27mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount
- Termination：Solder
- Fastening Type：Push-Pull
- Contact Length - Mating：0.130" (3.30mm)
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.226" (5.74mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：30.0µin (0.76µm)
- Contact Finish - Post：-
- Contact Material：-
- Insulation Material：Thermoplastic, Glass Filled
- Features：-
- Operating Temperature：-
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Natural
- Current Rating (Amps)：-
- Voltage Rating：-
Download product information
Overview
The Amphenol ICC (FCI) part number 10124055-01-130TLF is a surface mount header connector designed for high-density electronic applications. It features a 60-position configuration with a 1.27 mm pitch, utilizing liquid crystal polymer (LCP) housing material for enhanced thermal stability and signal integrity. The connector supports a maximum operating temperature of +130°C and includes locating pegs to ensure precise alignment during automated assembly processes. Contact plating is specified as gold to maintain reliable electrical performance over the component's operational lifecycle.
Feature Summary
- Surface mount design with integrated locating pegs for accurate board placement
- Liquid crystal polymer housing provides high thermal resistance up to +130°C
- Gold contact plating ensures durable and low-resistance electrical connections
Applications
- High-density data processing equipment
- Telecommunications infrastructure modules
- Industrial control systems requiring compact interconnects
Procurement Notes
Verify the specific suffix and pin count against official Amphenol documentation before ordering. Confirm that the surface mount footprint matches the target PCB layout. Ensure compatibility with reflow soldering profiles suitable for LCP materials. Check for RoHS compliance status if required by project specifications.
Selection Notes
Select this component when space constraints require a 1.27 mm pitch header in a surface mount format. The LCP material choice is critical for applications involving elevated temperatures or lead-free soldering processes. Verify that the 60-position requirement aligns with system I/O needs. Consider the mechanical stability provided by the locating pegs for high-volume manufacturing environments.
Part Context
This connector belongs to the broader FCI portfolio acquired by Amphenol, focusing on signal integrity and miniaturization. It represents the company's capability to produce high-reliability interconnects for demanding commercial and industrial markets. The design reflects industry trends toward smaller form factors without compromising electrical performance or thermal endurance.
Replacement Considerations
No direct substitute part numbers are publicly confirmed for this specific model. Cross-reference only with official Amphenol ICC (FCI) documentation to identify compatible alternatives within the same series.
