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Product Detailed Parameters
- Description：BS DR VT SMT HDR 2X3 TR
- Series：BERGSTIK®
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR),Cut Tape (CT)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.100" (2.54mm)
- Number of Positions：6
- Number of Rows：2
- Row Spacing - Mating：0.100" (2.54mm)
- Number of Positions Loaded：All
- Style：Board to Board
- Shrouding：Unshrouded
- Mounting Type：Surface Mount
- Termination：Solder
- Fastening Type：Push-Pull
- Contact Length - Mating：0.230" (5.84mm)
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.100" (2.54mm)
- Contact Shape：Square
- Contact Finish - Mating：Tin
- Contact Finish Thickness - Mating：100.0µin (2.54µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：Pick and Place
- Operating Temperature：-65°C ~ 125°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：3A per Contact
- Voltage Rating：1500VAC
Download product information
Overview
The Amphenol ICC (FCI) part number 10125394-T0803ALF is a backplane header connector belonging to the Millipacs® series. It features a vertical surface mount design with a dual-row configuration of 2x3 positions, totaling six contacts. The connector utilizes press-fit termination for secure board attachment and includes gold plating on the contact surfaces to ensure reliable signal transmission. This component is engineered for high-density applications requiring robust mechanical stability.
Feature Summary
- Vertical surface mount header design optimized for automated pick-and-place assembly processes
- Dual-row configuration providing compact high-density interconnect capability
- Gold-plated contact finish ensuring durable electrical performance in demanding environments
Applications
- High-density backplane interconnects
- Server and storage system architectures
- Telecommunications infrastructure equipment
Procurement Notes
Verify the specific suffix T0803ALF against official manufacturer documentation to confirm exact pin count and termination style. Ensure compatibility with mating receptacles within the same Millipacs® family. Cross-reference datasheets for precise dimensional tolerances and thermal profile requirements during soldering or press-fit operations.
Selection Notes
Select this component when a vertical, surface-mount backplane header is required for high-density signal routing. The dual-row layout supports efficient space utilization in constrained chassis designs. Confirm that the press-fit termination method aligns with the target printed circuit board manufacturing capabilities and structural integrity requirements.
Part Context
This connector belongs to the Millipacs® Hard Metric series by Amphenol ICC (FCI), designed for high-reliability backplane applications. The series offers various configurations to support complex system architectures. The specific model integrates standard hard metric spacing with modern mounting techniques for enhanced performance.
Replacement Considerations
Consult official substitution lists for compatible headers within the Millipacs® family. Verify mechanical footprint and electrical specifications before replacing with alternative part numbers from the same manufacturer.
