10126010-10003TLF

Description：CONN HEADER
Series：-
Mfr：Amphenol ICC (FCI)
Package：Tray

SKU:d7e5c37701c7 Category: Edgeboard Connectors Brand: Amphenol ICC (FCI)

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Product introduction

Product Detailed Parameters

Description：CONN HEADER
Series：-
Mfr：Amphenol ICC (FCI)
Package：Tray
Card Type：-
Gender：-
Number of Positions/Bay/Row：-
Number of Positions：-
Card Thickness：-
Number of Rows：-
Pitch：-
Read Out：-
Features：-
Mounting Type：-
Termination：-
Contact Material：-
Contact Finish：-
Contact Finish Thickness：-
Contact Type：-
Color：-
Flange Feature：-
Operating Temperature：-

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10126010-10003TLF

Overview

The Amphenol ICC (FCI) part number 10126010-10003TLF is a PCI Express Gen 3 card edge connector designed for straddle-mount installation. It features 164 positions with a pitch of 0.039 inches. The component is classified as an edgeboard connector header, intended for high-speed data transmission applications requiring reliable signal integrity and power delivery in server or industrial environments.

Feature Summary

Straddle-mount configuration for secure board retention
Optimized for PCI Express Gen 3 signal integrity
Header type construction for female mating contacts

Applications

PCI Express Gen 3 expansion cards
Server backplane interconnects
Industrial control system modules

Procurement Notes

Verify the specific suffix 'TLF' against the manufacturer's current datasheet to confirm plating composition and lead-free status. Ensure the straddle-mount footprint matches the target PCB design specifications before ordering. Confirm availability through authorized distributors as standard lead times may vary.

Selection Notes

Select this component when a straddle-mount solution is required for PCI Express Gen 3 applications. The 164-position count and 0.039-inch pitch must align with the host board layout. Verify that the header orientation and mounting style suit the mechanical constraints of the enclosure.

Part Context

This connector belongs to the Amphenol ICC (FCI) portfolio of high-performance interconnect solutions. It supports the growing demand for high-bandwidth data transfer in modern computing infrastructure. The product line emphasizes reliability and signal integrity for demanding electronic applications.