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The Amphenol ICC (FCI) 10126619-320022FLF is a dual-edge female card edge connector designed for high-performance computing environments. It features 54 positions, comprising 22 signal and 32 power contacts, arranged in a non-specified dual-edge configuration. The connector utilizes gold or GXT™ plated copper alloy contacts to ensure reliable signal integrity and low contact resistance. Constructed with black GXT™ thermoplastic insulation, it supports board thicknesses of 0.062 inches (1.57mm). This component is engineered for through-hole termination and offers robust mechanical stability.
Verify the specific ordering suffix against the official Amphenol ICC datasheet to confirm contact plating specifications and material composition. Ensure that the procurement documentation explicitly references the HPCE series characteristics. Confirm that the component matches the required 54-position count and dual-edge geometry before finalizing orders. Cross-reference the manufacturer part number with authorized distributor catalogs to avoid counterfeit components.
Select this connector when a high-density interface combining signal and power lines is required for dual-edge card applications. Evaluate the need for board lock features to prevent disconnection during vibration. Consider the operating temperature range and thermal management requirements of the host system. Verify compatibility with the target PCB stack-up and trace impedance requirements for high-speed data transmission.
This component belongs to the HPCE (High Performance Card Edge) series by Amphenol ICC, formerly FCI. The HPCE line is engineered for demanding applications requiring superior electrical performance and mechanical durability. Amphenol ICC integrates advanced materials and precision manufacturing to support high-speed data rates and power delivery in modern electronic systems.
Consult official Amphenol ICC substitution guides for verified alternative part numbers. Do not substitute with generic card edge connectors without verifying pinout compatibility and mechanical dimensions.