10126619-320022FLF

10126619-320022FLF

$5.46
  • Description:HPCE RAR-8HP22S
  • Series:HPCE®
  • Mfr:Amphenol ICC (FCI)
  • Package:Tray

SKU:41dd9247c3a9 Category: Brand:

  
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Product Detailed Parameters

  • Description:HPCE RAR-8HP22S
  • Series:HPCE®
  • Mfr:Amphenol ICC (FCI)
  • Package:Tray
  • Card Type:Non Specified - Dual Edge
  • Gender:Female
  • Number of Positions/Bay/Row:16; 11
  • Number of Positions:54 (22 + 32 Power)
  • Card Thickness:0.062" (1.57mm)
  • Number of Rows:2
  • Pitch:-
  • Read Out:Dual
  • Features:Board Guide
  • Mounting Type:Through Hole, Right Angle
  • Termination:Solder
  • Contact Material:Copper Alloy
  • Contact Finish:Gold
  • Contact Finish Thickness:30.0µin (0.76µm)
  • Contact Type:Cantilever
  • Color:Black
  • Flange Feature:-
  • Operating Temperature:-55°C ~ 105°C

Download product information

10126619-320022FLF

Overview

The Amphenol ICC (FCI) 10126619-320022FLF is a dual-edge female card edge connector designed for high-performance computing environments. It features 54 positions, comprising 22 signal and 32 power contacts, arranged in a non-specified dual-edge configuration. The connector utilizes gold or GXT™ plated copper alloy contacts to ensure reliable signal integrity and low contact resistance. Constructed with black GXT™ thermoplastic insulation, it supports board thicknesses of 0.062 inches (1.57mm). This component is engineered for through-hole termination and offers robust mechanical stability.

Feature Summary

  • Dual-edge female design accommodating both signal and power transmission within a single interface
  • Gold or GXT™ surface plating on copper alloy contacts for enhanced conductivity and corrosion resistance
  • Integrated board lock mechanism to secure the connector firmly to the printed circuit board
  • Black GXT™ thermoplastic housing providing thermal stability and structural rigidity

Applications

  • High-performance computing server backplanes
  • Data center interconnect systems
  • Telecommunications infrastructure equipment
  • Industrial control system motherboards

Procurement Notes

Verify the specific ordering suffix against the official Amphenol ICC datasheet to confirm contact plating specifications and material composition. Ensure that the procurement documentation explicitly references the HPCE series characteristics. Confirm that the component matches the required 54-position count and dual-edge geometry before finalizing orders. Cross-reference the manufacturer part number with authorized distributor catalogs to avoid counterfeit components.

Selection Notes

Select this connector when a high-density interface combining signal and power lines is required for dual-edge card applications. Evaluate the need for board lock features to prevent disconnection during vibration. Consider the operating temperature range and thermal management requirements of the host system. Verify compatibility with the target PCB stack-up and trace impedance requirements for high-speed data transmission.

Part Context

This component belongs to the HPCE (High Performance Card Edge) series by Amphenol ICC, formerly FCI. The HPCE line is engineered for demanding applications requiring superior electrical performance and mechanical durability. Amphenol ICC integrates advanced materials and precision manufacturing to support high-speed data rates and power delivery in modern electronic systems.

Replacement Considerations

Consult official Amphenol ICC substitution guides for verified alternative part numbers. Do not substitute with generic card edge connectors without verifying pinout compatibility and mechanical dimensions.

10126619-320022FLF10126619-320022FLF
$5.46
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