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Product Detailed Parameters
- Description：CONN HEADER
- Series：-
- Mfr：Amphenol ICC (FCI)
- Package：Tube
- Card Type：-
- Gender：-
- Number of Positions/Bay/Row：-
- Number of Positions：-
- Card Thickness：-
- Number of Rows：-
- Pitch：-
- Read Out：-
- Features：-
- Mounting Type：-
- Termination：-
- Contact Material：-
- Contact Finish：-
- Contact Finish Thickness：-
- Contact Type：-
- Color：-
- Flange Feature：-
- Operating Temperature：-
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Overview
The Amphenol ICC (FCI) 10127242-009LF is a Power to the Board header connector belonging to the MinitekPwr 3.0 series. It features a dual-row, through-hole mounting configuration with a 3 mm pitch. The component utilizes male pin contacts made of copper alloy with gold plating for reliable electrical performance. Designed for high-current applications, it supports a rated current of 8.5 A and a voltage rating of 600 VAC. The housing is constructed from black Liquid Crystal Polymer (LCP), providing thermal stability within an operating temperature range of -40°C to +105°C.
Feature Summary
- High current capacity suitable for power distribution in compact board layouts
- Gold-plated copper contacts ensure low contact resistance and corrosion resistance
- LCP insulation material provides high thermal stability and flame retardancy
- Through-hole termination offers robust mechanical fixation on printed circuit boards
Applications
- Server and storage system power distribution units
- Industrial control board power interfaces
- Telecommunications equipment power headers
- Data center infrastructure power connections
Procurement Notes
Verify the specific part number suffix against official Amphenol documentation to confirm contact plating thickness and packaging details. Ensure compatibility with mating socket specifications regarding current derating curves and thermal management requirements. Confirm that the through-hole footprint matches the target PCB design guidelines for soldering reliability.
Selection Notes
Select this component when high current carrying capability is required in a dense board-to-board or cable-to-board interface. The 3 mm pitch allows for significant spacing between power pins, reducing arcing risks. Consider the LCP material properties for environments requiring elevated temperature resistance compared to standard thermoplastics.
Part Context
This connector is part of the MinitekPwr 3.0 family, designed by Amphenol ICC (formerly FCI). The series focuses on delivering efficient power solutions for modern electronics where space constraints and thermal performance are critical. It complements other components in the same series offering various pin counts and configurations.
Replacement Considerations
Direct substitutes must match the 3 mm pitch, dual-row through-hole format, and 8.5 A current rating. Verify that alternative manufacturers provide equivalent LCP insulation and gold-plated contact materials to maintain performance parity.
