10127242-009PLF

10127242-009PLF

  • Description:CONN HEADER
  • Series:-
  • Mfr:Amphenol ICC (FCI)
  • Package:Tube

SKU:a9b7451177c9 Category: Brand:

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Product Detailed Parameters

  • Description:CONN HEADER
  • Series:-
  • Mfr:Amphenol ICC (FCI)
  • Package:Tube
  • Card Type:-
  • Gender:-
  • Number of Positions/Bay/Row:-
  • Number of Positions:-
  • Card Thickness:-
  • Number of Rows:-
  • Pitch:-
  • Read Out:-
  • Features:-
  • Mounting Type:-
  • Termination:-
  • Contact Material:-
  • Contact Finish:-
  • Contact Finish Thickness:-
  • Contact Type:-
  • Color:-
  • Flange Feature:-
  • Operating Temperature:-

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10127242-009PLF

Overview

The 10127242-009PLF is a Power to the Board header connector from the MinitekPwr 3.0 series by Amphenol ICC (FCI). It features a 3 mm pitch and a dual-row, vertical surface-mount configuration with 4 positions. The contacts are gold-plated, supporting an 8.5 A current rating per contact. Designed for high-power density applications, it utilizes a copper alloy construction with a black thermoplastic housing. The component operates within a temperature range of -40°C to +105°C and offers 1 GOhm insulation resistance.

Feature Summary

  • Dual-row vertical header design optimized for board-to-board power distribution
  • Gold-plated contacts ensure reliable signal integrity and corrosion resistance
  • High current capacity of 8.5 A per position supports dense power routing
  • Surface-mount termination facilitates automated pick-and-place assembly

Applications

  • Server and storage system power distribution modules
  • Telecommunications infrastructure equipment
  • Industrial control systems requiring compact power solutions
  • Data processing hardware power delivery networks

Procurement Notes

Verify the specific ordering suffix PLF confirms lead-free compliance and gold plating thickness before procurement. Confirm that the 4-position count matches the target circuit requirements. Ensure the vertical orientation aligns with the mechanical stack-up constraints of the host PCB assembly process.

Selection Notes

Select this component when a 3 mm pitch is required for high-current power delivery in a space-constrained environment. The dual-row layout maximizes current capacity while maintaining a minimal footprint. Consider the vertical profile for clearance requirements relative to adjacent components on the motherboard.

Part Context

This part belongs to the MinitekPwr 3.0 family, engineered for demanding power-to-the-board applications. The series emphasizes high current handling and signal integrity through precise contact geometry. It represents Amphenol ICC's strategy to provide robust interconnect solutions for next-generation computing and communication architectures.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation. Verify compatibility with mating connectors using official cross-reference data if alternative sourcing is necessary.

10127242-009PLF10127242-009PLF

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