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The 10127242-009PLF is a Power to the Board header connector from the MinitekPwr 3.0 series by Amphenol ICC (FCI). It features a 3 mm pitch and a dual-row, vertical surface-mount configuration with 4 positions. The contacts are gold-plated, supporting an 8.5 A current rating per contact. Designed for high-power density applications, it utilizes a copper alloy construction with a black thermoplastic housing. The component operates within a temperature range of -40°C to +105°C and offers 1 GOhm insulation resistance.
Verify the specific ordering suffix PLF confirms lead-free compliance and gold plating thickness before procurement. Confirm that the 4-position count matches the target circuit requirements. Ensure the vertical orientation aligns with the mechanical stack-up constraints of the host PCB assembly process.
Select this component when a 3 mm pitch is required for high-current power delivery in a space-constrained environment. The dual-row layout maximizes current capacity while maintaining a minimal footprint. Consider the vertical profile for clearance requirements relative to adjacent components on the motherboard.
This part belongs to the MinitekPwr 3.0 family, engineered for demanding power-to-the-board applications. The series emphasizes high current handling and signal integrity through precise contact geometry. It represents Amphenol ICC's strategy to provide robust interconnect solutions for next-generation computing and communication architectures.
No public confirmed substitute part numbers are available in the provided documentation. Verify compatibility with mating connectors using official cross-reference data if alternative sourcing is necessary.