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Product Detailed Parameters
- Description：CONN MTK3.0 DR 02P VT HDR SN
- Series：Minitek® Pwr 3.0
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：-
- Number of Positions：2
- Number of Rows：2
- Row Spacing - Mating：0.118" (3.00mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole
- Termination：Kinked Pin, Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：0.126" (3.20mm)
- Overall Contact Length：-
- Insulation Height：0.433" (11.00mm)
- Contact Shape：Square
- Contact Finish - Mating：Tin
- Contact Finish Thickness - Mating：100.0µin (2.54µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：Board Guide, Pick and Place
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：Varies by Wire Gauge
- Voltage Rating：600VAC/DC
Download product information
Overview
The Amphenol ICC (FCI) part number 10127721-021RLF is a Minitek Power3.0 series power-to-board header connector designed for high-current applications. It features a dual-row configuration with 2 positions and a 3 mm pitch. The connector utilizes male pin contacts made of copper with gold plating, rated for 8.5 A current and 600 VAC voltage. It employs a through-hole solder termination style with a straight mounting orientation. The housing is constructed from natural Liquid Crystal Polymer (LCP), providing an operating temperature range from -40°C to +105°C and an insulation resistance of 1 GOhms.
Feature Summary
- Dual-row power header design optimized for board-to-board power distribution
- Gold-plated copper contacts ensure reliable conductivity and corrosion resistance
- Liquid Crystal Polymer (LCP) housing provides thermal stability and high insulation resistance
Applications
- High-density power distribution in industrial equipment
- Power connections in server and storage systems
- Electrical interconnects in communication infrastructure
Procurement Notes
Verify the specific suffix 'RLF' against official Amphenol documentation to confirm gold plating and reel packaging requirements. Confirm that the 2-position variant matches the intended circuit density. Ensure compatibility with mating receptacles within the Minitek Power3.0 system. Check for any recent product change notifications affecting material composition or manufacturing location.
Selection Notes
Select this component when a low-profile, high-current connection is required between boards. The 3 mm pitch allows for robust spacing suitable for power lines. Verify that the through-hole mounting method aligns with the PCB fabrication capabilities. Consider the 600 VAC rating for safety margins in high-voltage sections of the assembly.
Part Context
This connector belongs to the Minitek Power3.0 family, a line of power connectors engineered by Amphenol FCI. The series is characterized by its 3 mm contact spacing and ability to handle significant current loads. It is distinct from signal-oriented headers due to its reinforced contact design and specialized housing materials aimed at thermal management.
Replacement Considerations
Direct substitutes must match the 3 mm pitch, dual-row layout, and 2-position count. Compatible alternatives may include other Minitek Power3.0 variants with different contact counts but identical mechanical interfaces. Verify that any replacement maintains the same current rating and voltage withstand capabilities.
