10127721-022GLF

Overview

The Amphenol ICC (FCI) part number 10127721-022GLF is a Minitek Power3.0 series vertical through-hole header designed for power-to-board applications. This component features a dual-row configuration with 2 positions and a 3 mm pitch. It utilizes male pin contacts made of copper alloy, finished with gold plating to ensure reliable conductivity. The housing is constructed from Liquid Crystal Polymer (LCP), providing high thermal stability and insulation resistance of 1 GOhms. Rated for 8.5 A current and 600 VAC voltage, it operates within a temperature range of -40°C to +105°C.

Feature Summary

• Vertical orientation with through-hole solder pin termination for secure board mounting
• Dual-row shrouded header design utilizing Liquid Crystal Polymer (LCP) housing material
• Gold-plated copper alloy contacts ensuring stable electrical performance in power applications

Applications

• Power distribution on main circuit boards
• High-current signal interconnection in industrial equipment
• Server and storage device internal power connections

Procurement Notes

Verify the specific suffix 'GLF' confirms lead-free and RoHS compliance status directly with the manufacturer or authorized distributor before procurement. Confirm that the 2-position variant matches the exact current and voltage requirements of the target circuit design. Ensure the vertical through-hole mounting style aligns with the PCB layout constraints and assembly processes utilized in the final product manufacturing.

Selection Notes

Select this component when a low-count, high-reliability power connection is required on dense circuit boards. The 3 mm pitch allows for substantial contact spacing suitable for higher current loads compared to smaller pitch systems. Consider the LCP material properties for environments requiring resistance to high soldering temperatures and chemical exposure during assembly processes.

Part Context

This connector belongs to the Minitek Power3.0 family produced by Amphenol ICC (formerly FCI). The series is engineered for robust power delivery in demanding electronic environments. As an Amphenol product, it adheres to strict quality standards for durability and signal integrity. The specific model represents a compact solution within the broader portfolio of power-to-board interconnect systems.

Replacement Considerations

Compatible substitutes within the same Minitek Power3.0 series include other position variants such as 10127721-024GLF or 10127721-121SLF, provided the pin count and contact plating match the design requirements. Verify mechanical dimensions and mating interface compatibility before substituting.