10127721-024GLF

Overview

The Amphenol ICC (FCI) 10127721-024GLF is a Minitek Power3.0 series power-to-board header connector designed for vertical through-hole mounting. It features a dual-row configuration with two positions and a 3 mm pitch. The contacts are male pins made of copper alloy, plated with 30 microinches of gold to ensure reliable conductivity. Rated for 8.5 A current and 600 VAC voltage, the connector utilizes a black Liquid Crystal Polymer (LCP) housing. It operates within a temperature range of -40°C to +105°C and provides an insulation resistance of 1 GOhms.

Feature Summary

• Vertical through-hole termination for secure board integration
• Dual-row layout with 3 mm spacing for high-density power distribution
• Gold-plated copper alloy contacts for corrosion resistance and low contact impedance
• LCP housing material rated UL94 V-0 for thermal stability

Applications

• Power distribution in server and storage equipment
• High-current connections in communication infrastructure
• Industrial control system power interfaces
• Data center power supply unit interconnects

Procurement Notes

Verify the specific part number against official Amphenol FCI documentation to confirm pin count, plating thickness, and orientation. Ensure compatibility with mating receptacles within the Minitek Power3.0 family. Confirm that the vertical through-hole form factor aligns with the target PCB design requirements and assembly processes.

Selection Notes

Select this component when a compact, high-current vertical header is required for power delivery. The 3 mm pitch allows for significant current capacity relative to footprint size. Verify that the 600 VAC rating meets the system's electrical isolation needs. Consider the operating temperature range and LCP material properties for environmental resilience during deployment.

Part Context

This connector belongs to the Minitek Power3.0 product line by Amphenol ICC (FCI), formerly Framatome Connectors International. The series specializes in robust power interconnect solutions for demanding industrial and data communication environments. The brand is recognized for durable connectors that withstand vibration and thermal stress while maintaining signal integrity.

Replacement Considerations

Cross-reference with other Minitek Power3.0 headers sharing the same 3 mm pitch and dual-row configuration. Ensure identical current ratings and voltage specifications before substitution. Verify mechanical dimensions and mounting style compatibility to maintain PCB assembly integrity.