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The Amphenol ICC (FCI) part number 10127721-061GRLF is a Minitek Pwr 3.0 series power connector designed for board-to-board applications. It features a vertical header configuration with six positions arranged in two rows. The connector utilizes a 3.00 mm pitch and incorporates male pin contacts made of copper alloy, finished with tin plating on the post and gold mating surfaces. Rated for 600VAC/DC, it operates within a temperature range of -40°C to +105°C and meets UL94 V-0 flammability standards.
Verify current availability status directly with authorized distributors or the manufacturer, as supply chain conditions may vary. Confirm that the specific suffix GRLF matches your required contact finish and orientation specifications against the official datasheet before placing orders. Ensure compatibility with mating receptacles from the same Minitek Pwr 3.0 family to maintain proper engagement and electrical performance.
Select this component when a vertical, six-position power header is required for high-current applications up to 600VAC/DC. The 3.00 mm pitch allows for robust current handling compared to finer pitches. Consider the tin-post and gold-mating finish combination for cost-effective reliability. Ensure the PCB layout accommodates the specified insulation height and row spacing for proper mechanical fit and thermal management.
This connector belongs to the Minitek Pwr 3.0 product line by Amphenol ICC (FCI), a series known for high-power density solutions. It is part of a broader ecosystem of rectangular connectors designed for demanding environments. The 10127721 base series typically includes various position counts and orientations, with this specific variant focusing on a low-profile vertical header format suitable for space-constrained power delivery systems.
Compatible substitutes include other 6-position, 3.00mm pitch vertical headers from the Minitek Pwr 3.0 series, such as 10127721-061LF or 10127721-061GLF, provided the contact finish requirements match. Verify mechanical dimensions and locking mechanisms to ensure interchangeability without redesigning the host PCB.