10127721-085GLF

Overview

The Amphenol ICC (FCI) 10127721-085GLF is a Minitek Power3.0 series male header connector designed for power-to-board applications. It features an 8-position configuration with a 3.00mm pitch and dual-row arrangement. The component utilizes through-hole termination with solder pins and offers a vertical mounting style. Constructed from copper alloy contacts with gold plating, it ensures reliable conductivity within a black liquid crystal polymer (LCP) insulator rated UL94 V-0. The connector supports a maximum operating temperature of +105°C and withstands up to 600VAC.

Feature Summary

• Dual-row shrouded header design providing robust mechanical stability and four-wall shielding for contact protection.
• Gold-plated copper alloy contacts ensure high conductivity and corrosion resistance for durable mating cycles.
• Vertical orientation with through-hole solder termination facilitates secure board integration and alignment.

Applications

• Industrial automation control systems
• Power distribution units in server infrastructure
• Heavy equipment instrumentation panels

Procurement Notes

Verify the specific suffix GLF indicates gold plating on contacts as per manufacturer datasheets. Confirm that the 8-position count matches the required circuit density for the target PCB layout. Ensure the vertical height and row spacing align with enclosure constraints. Cross-reference the UL94 V-0 rating against local fire safety regulations for the intended deployment environment.

Selection Notes

Select this model when a low-profile, high-current vertical header is required for wire-to-board connections. The 3.00mm pitch allows for higher current capacity compared to finer pitches. Consider the gold finish for environments requiring superior oxidation resistance. Evaluate the dual-row configuration against available panel space to maximize connection density without compromising thermal management requirements.

Part Context

This component belongs to the Minitek Power3.0 family, engineered for demanding power delivery scenarios. The series emphasizes durability and signal integrity in compact form factors. As part of Amphenol's interconnect portfolio, it integrates standardized dimensions with specialized material properties to support rigorous industrial and commercial electronic assemblies.

Replacement Considerations

Compatible substitutes include other Minitek Power3.0 headers with identical 8-position counts and vertical orientations. Verify that alternative parts maintain the same 3.00mm pitch and dual-row architecture. Ensure replacement components offer equivalent gold plating thickness and LCP insulation ratings to preserve electrical performance and thermal stability.