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Product Detailed Parameters
- Description：10127721-085SLF-MTK 3.0 08P DR V
- Series：Minitek® Pwr 3.0
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：8
- Number of Rows：2
- Row Spacing - Mating：0.118" (3.00mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole
- Termination：Kinked Pin, Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：0.126" (3.20mm)
- Overall Contact Length：-
- Insulation Height：0.433" (11.00mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：Flash
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Liquid Crystal Polymer (LCP), Glass Filled, Halogen Free
- Features：Board Guide
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Natural
- Current Rating (Amps)：Varies by Wire Gauge
- Voltage Rating：600VAC/DC
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Overview
The Amphenol ICC (FCI) part number 10127721-085SLF is a Minitek Power3.0 series power-to-board header connector. It features a dual-row configuration with 8 positions and a 3.00 mm pitch. The contacts are male pins with tin plating, rated for 8.5 A current and 600 VAC voltage. Designed for through-hole vertical mounting, the housing is natural-colored liquid crystal polymer (LCP). The operating temperature range spans from -40°C to +105°C, with an insulation resistance of 1 GOhms.
Feature Summary
- Dual-row power-to-board header design
- Through-hole vertical termination
- Tin-plated male pin contacts
Applications
- Industrial equipment power distribution
- Factory automation systems
- Power supply units
Procurement Notes
Verify the specific suffix SLF indicates tin plating rather than gold or other finishes when sourcing. Confirm that the 8-position count matches the schematic requirements. Ensure the vertical through-hole form factor fits the PCB assembly constraints. Check for any recent product change notices affecting material composition or manufacturing location.
Selection Notes
Select this component for applications requiring high current capacity in a compact vertical profile. The 3.00 mm pitch allows for robust power traces while maintaining board density. Tin plating offers cost-effective conductivity suitable for general industrial environments. Verify compatibility with mating receptacles within the Minitek Power3.0 ecosystem.
Part Context
This connector belongs to the Minitek Power3.0 family by Amphenol FCI, designed for reliable power delivery. The series supports various position counts and plating options to suit different electrical and environmental needs. It is engineered for durability in demanding industrial and commercial settings.
Replacement Considerations
Cross-reference with other 8-position Minitek Power3.0 headers if availability is limited. Ensure substitute parts maintain the same 3.00 mm pitch and vertical orientation. Verify that alternative plating options do not compromise corrosion resistance requirements.
