10127721-086GLF

10127721-086GLF

$0.56
  • Description:10127721-086GLF-MTK 3.0 08P DR V
  • Series:Minitek® Pwr 3.0
  • Mfr:Amphenol ICC (FCI)
  • Package:Tray

SKU:2e5efab497de Category: Brand:

  
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Product Detailed Parameters

  • Description:10127721-086GLF-MTK 3.0 08P DR V
  • Series:Minitek® Pwr 3.0
  • Mfr:Amphenol ICC (FCI)
  • Package:Tray
  • Connector Type:Header
  • Contact Type:Male Pin
  • Pitch - Mating:0.118" (3.00mm)
  • Number of Positions:8
  • Number of Rows:2
  • Row Spacing - Mating:0.118" (3.00mm)
  • Number of Positions Loaded:All
  • Style:Board to Cable/Wire
  • Shrouding:Shrouded - 4 Wall
  • Mounting Type:Through Hole
  • Termination:Kinked Pin, Solder
  • Fastening Type:Locking Ramp
  • Contact Length - Mating:-
  • Contact Length - Post:0.126" (3.20mm)
  • Overall Contact Length:-
  • Insulation Height:0.433" (11.00mm)
  • Contact Shape:Square
  • Contact Finish - Mating:Tin
  • Contact Finish Thickness - Mating:100.0µin (2.54µm)
  • Contact Finish - Post:Tin
  • Contact Material:Copper Alloy
  • Insulation Material:Liquid Crystal Polymer (LCP), Halogen Free
  • Features:Board Guide
  • Operating Temperature:-40°C ~ 105°C
  • Ingress Protection:-
  • Material Flammability Rating:UL94 V-0
  • Insulation Color:Black
  • Current Rating (Amps):Varies by Wire Gauge
  • Voltage Rating:600VAC/DC

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10127721-086GLF

Overview

The Amphenol ICC (FCI) 10127721-086GLF is a Minitek Power 3.0 series header connector designed for power-to-board applications. It features an 8-position, dual-row configuration with a 3.00mm pitch and vertical through-hole mounting style. The contacts are manufactured from copper alloy with a tin plating finish to ensure reliable conductivity. Rated for 600VAC and 8.5A current, the unit utilizes liquid crystal polymer (LCP) insulation in black. It operates within a temperature range of -40°C to +105°C and includes board lock features.

Feature Summary

  • Dual-row vertical header design for compact power distribution
  • Tin-plated copper alloy contacts for corrosion resistance
  • Liquid crystal polymer insulation for high thermal stability
  • Board lock mechanism ensures secure mechanical retention

Applications

  • Power distribution modules in industrial equipment
  • Server and storage system power interfaces
  • Communication infrastructure power headers
  • High-current board-to-cable connections

Procurement Notes

Verify the specific contact plating and pin count against the official datasheet before integration. Confirm that the vertical through-hole termination method aligns with the target PCB assembly process. Ensure the 3.00mm pitch matches the mating connector footprint requirements. Check compliance with UL94 V-0 flammability standards if required by the application environment.

Selection Notes

Select this component when a robust, high-voltage power header is required for vertical mounting. The dual-row layout maximizes current capacity within a limited board area. The tin finish offers cost-effective durability compared to gold plating. Verify that the 8.5A rating per contact meets the circuit load demands without excessive heating.

Part Context

This part belongs to the Minitek Power 3.0 family, engineered for demanding power delivery scenarios. The series provides standardized solutions for server, storage, and communication hardware. It integrates signal and power capabilities into durable, low-profile connectors suitable for automated assembly processes.

Replacement Considerations

Compatible substitutes include other 8-position, 3.00mm pitch dual-row headers from the same manufacturer series. Ensure replacement parts maintain identical voltage ratings and through-hole termination styles. Verify that the board lock feature is present to prevent accidental disconnection during operation.

10127721-086GLF10127721-086GLF
$0.56
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