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Product Detailed Parameters
- Description：CONN HEADER VERT 10POS 3MM
- Series：Minitek® Pwr 3.0
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：10
- Number of Rows：2
- Row Spacing - Mating：0.118" (3.00mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole
- Termination：Kinked Pin, Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：0.126" (3.20mm)
- Overall Contact Length：-
- Insulation Height：0.433" (11.00mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：Flash
- Contact Finish - Post：Gold
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：Board Guide
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：Varies by Wire Gauge
- Voltage Rating：600VAC/DC
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Overview
The Amphenol ICC (FCI) 10127721-102LF is a Minitek Power3.0 series through-hole header designed for power-to-board applications. It features a double row configuration with 10 positions and a 3 mm pitch. The connector utilizes copper contacts with gold plating, rated for 8.5 A current and 600 VAC voltage. Constructed with liquid crystal polymer insulation, it operates within a temperature range of -40°C to +105°C and offers an insulation resistance of 1 GOhms.
Feature Summary
- Double-row vertical through-hole design for secure board mounting
- Gold-plated copper contacts ensure reliable electrical conductivity
- High dielectric strength housing material supports high-voltage isolation
Applications
- Power distribution in industrial control systems
- Server and storage equipment power interfaces
- Telecommunications infrastructure power connections
Procurement Notes
Verify the specific suffix requirements against the official datasheet before ordering. Confirm that the requested part number matches the exact pin count and contact plating specifications required for your circuit design. Ensure compatibility with standard surface-mount or through-hole assembly processes used in your manufacturing line.
Selection Notes
Select this component when a compact, high-current vertical interconnect is needed. The 3 mm pitch allows for robust spacing suitable for power lines. Verify that the 8.5 A rating per contact meets the load requirements of the target application without exceeding thermal limits.
Part Context
This header belongs to the Minitek Power3.0 family, which provides standardized solutions for high-power density connections. The series is engineered for durability in demanding environments, offering consistent performance across various electronic assemblies requiring reliable power delivery.
Replacement Considerations
Check for direct substitutes within the same Minitek Power3.0 series that share identical mechanical dimensions and electrical ratings. Ensure any alternative part maintains the same 3 mm pitch and double-row configuration to fit existing PCB footprints.
