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Product Detailed Parameters
- Description：10127721-106GLF-MTK 3.0 10P DR V
- Series：Minitek® Pwr 3.0
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：10
- Number of Rows：2
- Row Spacing - Mating：0.118" (3.00mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole
- Termination：Kinked Pin, Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：0.126" (3.20mm)
- Overall Contact Length：-
- Insulation Height：0.433" (11.00mm)
- Contact Shape：Square
- Contact Finish - Mating：Tin
- Contact Finish Thickness - Mating：100.0µin (2.54µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Liquid Crystal Polymer (LCP), Halogen Free
- Features：Board Guide
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：Varies by Wire Gauge
- Voltage Rating：600VAC/DC
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Overview
The Amphenol ICC (FCI) 10127721-106GLF is a Minitek Power 3.0 series power-to-board header connector designed for high-current applications. It features a dual-row, vertical through-hole configuration with 10 positions and a 3 mm pitch. The contacts are gold-plated copper pins rated for 8.5 A at 600 VAC. Constructed with a black Liquid Crystal Polymer (LCP) housing, it operates within a temperature range of -40°C to +105°C and maintains an insulation resistance of 1 GOhms.
Feature Summary
- Dual-row vertical design for compact power distribution
- Gold-plated copper contacts ensure reliable conductivity
- High-temperature LCP housing for thermal stability
Applications
- Server and storage equipment power buses
- Industrial automation power modules
- Telecommunications infrastructure boards
Procurement Notes
Verify the specific suffix 'GLF' confirms lead-free compliance and gold plating thickness against the official datasheet. Confirm availability status as this part may be subject to factory special order requirements or regional shipping restrictions. Cross-reference the 10-position count to ensure compatibility with mating receptacles.
Selection Notes
Select this component when a vertical, dual-row power header is required for board-level interconnects. Ensure the 3 mm pitch matches the PCB footprint and that the 8.5 A current rating meets the circuit load requirements. Verify that the operating temperature range aligns with the environmental conditions of the target assembly.
Part Context
This connector belongs to the Minitek Power 3.0 family by Amphenol FCI, specialized for robust power delivery in dense electronic assemblies. The series utilizes a standardized 3 mm spacing to accommodate higher currents compared to signal connectors, supporting industrial and data communication environments.
Replacement Considerations
Compatible substitutes include other Minitek Power 3.0 headers with identical 10-position, dual-row, vertical specifications. Verify matching pin plating and housing material before substitution.
