10127721-106SLF

10127721-106SLF

$0.68
  • Description:10127721-106SLF-MTK 3.0 10P DR V
  • Series:Minitek® Pwr 3.0
  • Mfr:Amphenol ICC (FCI)
  • Package:Tray

SKU:de58b7af748b Category: Brand:

  
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Product Detailed Parameters

  • Description:10127721-106SLF-MTK 3.0 10P DR V
  • Series:Minitek® Pwr 3.0
  • Mfr:Amphenol ICC (FCI)
  • Package:Tray
  • Connector Type:Header
  • Contact Type:Male Pin
  • Pitch - Mating:0.118" (3.00mm)
  • Number of Positions:10
  • Number of Rows:2
  • Row Spacing - Mating:0.118" (3.00mm)
  • Number of Positions Loaded:All
  • Style:Board to Cable/Wire
  • Shrouding:Shrouded - 4 Wall
  • Mounting Type:Through Hole
  • Termination:Kinked Pin, Solder
  • Fastening Type:Locking Ramp
  • Contact Length - Mating:-
  • Contact Length - Post:0.126" (3.20mm)
  • Overall Contact Length:-
  • Insulation Height:0.433" (11.00mm)
  • Contact Shape:Square
  • Contact Finish - Mating:Tin
  • Contact Finish Thickness - Mating:100.0µin (2.54µm)
  • Contact Finish - Post:Tin
  • Contact Material:Copper Alloy
  • Insulation Material:Liquid Crystal Polymer (LCP), Halogen Free
  • Features:Board Guide
  • Operating Temperature:-40°C ~ 105°C
  • Ingress Protection:-
  • Material Flammability Rating:UL94 V-0
  • Insulation Color:Natural
  • Current Rating (Amps):Varies by Wire Gauge
  • Voltage Rating:600VAC/DC

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10127721-106SLF

Overview

The Amphenol ICC (FCI) 10127721-106SLF is a Minitek Pwr 3.0 series power-to-board header connector designed for high-current applications. It features a double row configuration with 12 positions and a 3 mm pitch. The contacts are male pins made of copper alloy with tin plating, rated for 8.5 A current and 600 VAC voltage. Designed for through-hole vertical mounting, the housing is constructed from black liquid crystal polymer (LCP). The unit operates within a temperature range of -40°C to +105°C and provides an insulation resistance of 1 GOhms.

Feature Summary

  • Double-row pin header design facilitates high-density power distribution on printed circuit boards.
  • Tin-plated copper alloy contacts ensure reliable electrical conductivity and corrosion resistance.
  • Liquid crystal polymer housing offers thermal stability and mechanical durability in demanding environments.

Applications

  • Industrial control systems requiring robust power connections
  • Power distribution units in server infrastructure
  • Telecommunications equipment board-to-board interconnects

Procurement Notes

Verify the specific suffix 'SLF' confirms tin plating rather than gold, as this affects solderability and cost. Confirm the 12-position count matches the PCB footprint requirements. Ensure the through-hole vertical orientation aligns with the assembly process. Check for RoHS compliance status if required by project specifications. Validate that the 8.5 A rating meets the system's peak current demands.

Selection Notes

Select this component when a 3 mm pitch power header is required for vertical board mounting. The tin finish is suitable for standard lead-free soldering processes. Consider the 600 VAC rating for isolation requirements. The LCP material supports reflow soldering temperatures without deformation. Compare against other Minitek Pwr 3.0 variants if different contact counts or plating options are needed.

Part Context

This part belongs to the Minitek Pwr 3.0 family, a specialized line of power connectors from Amphenol ICC (FCI). The series is engineered for high-current applications, distinguishing itself from signal-only headers. The 10127721 prefix identifies the specific header housing and contact arrangement within the broader Minitek ecosystem.

Replacement Considerations

Direct substitutes include other 12-position, 3 mm pitch, double-row headers from the same manufacturer with identical tin plating. Verify that any alternative maintains the same 8.5 A current rating and LCP housing material to ensure thermal and electrical compatibility.

10127721-106SLF10127721-106SLF
$0.68
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