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The Amphenol ICC (FCI) 10127721-106SLF is a Minitek Pwr 3.0 series power-to-board header connector designed for high-current applications. It features a double row configuration with 12 positions and a 3 mm pitch. The contacts are male pins made of copper alloy with tin plating, rated for 8.5 A current and 600 VAC voltage. Designed for through-hole vertical mounting, the housing is constructed from black liquid crystal polymer (LCP). The unit operates within a temperature range of -40°C to +105°C and provides an insulation resistance of 1 GOhms.
Verify the specific suffix 'SLF' confirms tin plating rather than gold, as this affects solderability and cost. Confirm the 12-position count matches the PCB footprint requirements. Ensure the through-hole vertical orientation aligns with the assembly process. Check for RoHS compliance status if required by project specifications. Validate that the 8.5 A rating meets the system's peak current demands.
Select this component when a 3 mm pitch power header is required for vertical board mounting. The tin finish is suitable for standard lead-free soldering processes. Consider the 600 VAC rating for isolation requirements. The LCP material supports reflow soldering temperatures without deformation. Compare against other Minitek Pwr 3.0 variants if different contact counts or plating options are needed.
This part belongs to the Minitek Pwr 3.0 family, a specialized line of power connectors from Amphenol ICC (FCI). The series is engineered for high-current applications, distinguishing itself from signal-only headers. The 10127721 prefix identifies the specific header housing and contact arrangement within the broader Minitek ecosystem.
Direct substitutes include other 12-position, 3 mm pitch, double-row headers from the same manufacturer with identical tin plating. Verify that any alternative maintains the same 8.5 A current rating and LCP housing material to ensure thermal and electrical compatibility.