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The Amphenol ICC (FCI) 10127721-122LF is a Minitek Power3.0 series power-to-board header connector designed for vertical through-hole mounting. It features a dual-row configuration with 12 positions and a 3 mm pitch. The contacts are constructed from copper alloy with gold plating to ensure reliable conductivity and corrosion resistance. Rated for 8.5 A current and 600 VAC voltage, the housing utilizes black liquid crystal polymer (LCP) material compliant with UL94 V-0 flammability standards. Operating temperatures range from -40°C to +105°C.
Verify the specific ordering suffix against official Amphenol documentation to confirm contact plating and housing color specifications. Ensure compatibility with mating sockets within the Minitek Power3.0 ecosystem. Confirm lead times as these components may be subject to special order requirements. Cross-reference pin count and pitch dimensions with target PCB layouts prior to procurement.
Select this component when a robust, high-current vertical interconnect is required for industrial or commercial applications. The 3 mm pitch accommodates substantial wire gauges compared to smaller pitch alternatives. Verify that the 8.5 A rating aligns with system power requirements. Consider the gold plating option for environments requiring superior oxidation resistance compared to tin-plated variants.
This part belongs to the Minitek Pwr 3.0 family, a specialized line of power connectors developed by Amphenol FCI. The series focuses on providing reliable power delivery in compact form factors suitable for board-level integration. Components in this family share common mechanical interfaces and mating characteristics, facilitating modular design approaches across various electronic equipment categories.
Direct substitutes include other 12-position, 3 mm pitch dual-row headers from the same manufacturer series. Alternative suppliers must match the vertical orientation, through-hole termination style, and electrical ratings. Verify housing material properties and flammability ratings to ensure equivalent performance under operational stress.