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Product Detailed Parameters
- Description：10127721-125LF-MTK 3.0 12P DR VT
- Series：Minitek® Pwr 3.0
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：12
- Number of Rows：2
- Row Spacing - Mating：0.118" (3.00mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole
- Termination：Kinked Pin, Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：0.126" (3.20mm)
- Overall Contact Length：-
- Insulation Height：0.433" (11.00mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：Flash
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Liquid Crystal Polymer (LCP), Glass Filled, Halogen Free
- Features：Board Guide
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：Varies by Wire Gauge
- Voltage Rating：600VAC/DC
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Overview
The Amphenol ICC (FCI) 10127721-125LF is a Minitek Pwr 3.0 series power-to-board header connector designed for high-current applications. It features a 12-position, double-row configuration with a 3 mm pitch and straight through-hole mounting style. The contacts are gold-plated copper pins rated for 8.5 A current and 600 VAC voltage. Constructed with natural liquid crystal polymer (LCP) insulation, it operates within a temperature range of -40°C to +105°C and utilizes solder pin termination.
Feature Summary
- High current capacity suitable for power distribution
- Gold-plated contacts for reliable conductivity
- Thermally stable LCP housing material
Applications
- Industrial power supply modules
- Server and storage backplanes
- Power distribution units
Procurement Notes
Verify the specific suffix against official Amphenol documentation to confirm plating thickness and packaging type. Ensure the ordering part number matches the required contact count and row configuration. Cross-reference the datasheet for any recent product change notifications that may affect material specifications or manufacturing origin.
Selection Notes
Select this component when a robust, high-current interconnect solution is required for board-to-board power transmission. The 3 mm pitch allows for wider spacing between conductors compared to standard signal headers. Verify that the PCB layout accommodates the through-hole soldering requirements and the physical dimensions of the double-row header assembly.
Part Context
This connector belongs to the Minitek Pwr 3.0 family, which provides standardized solutions for power delivery in compact electronic systems. The series offers various position counts and mounting styles to support diverse design constraints while maintaining consistent electrical performance and mechanical reliability across different industrial applications.
Replacement Considerations
Consult official cross-reference lists for direct substitutes. Generic equivalents may not match the specific LCP material properties or gold plating standards required for high-reliability power applications.
