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Product Detailed Parameters
- Description：10127721-126SLF-MTK 3.0 12P DR V
- Series：Minitek® Pwr 3.0
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：12
- Number of Rows：2
- Row Spacing - Mating：0.118" (3.00mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole
- Termination：Kinked Pin, Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：0.126" (3.20mm)
- Overall Contact Length：-
- Insulation Height：0.433" (11.00mm)
- Contact Shape：Square
- Contact Finish - Mating：Tin
- Contact Finish Thickness - Mating：100.0µin (2.54µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Liquid Crystal Polymer (LCP), Halogen Free
- Features：Board Guide
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Natural
- Current Rating (Amps)：Varies by Wire Gauge
- Voltage Rating：600VAC/DC
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Overview
The 10127721-126SLF is a Minitek Power3.0 series header connector manufactured by Amphenol ICC (FCI). It features a dual-row, vertical through-hole design with 12 positions and a 3.00mm pitch. The contacts are tin-plated copper pins housed in natural Liquid Crystal Polymer (LCP). Rated for 8.5A current and 600VAC voltage, it operates within a temperature range of -40°C to +105°C and offers 1 GOhm insulation resistance.
Feature Summary
- Dual-row vertical through-hole header configuration
- High current capacity suitable for power distribution
- Thermally stable LCP housing material
Applications
- Power-to-board interconnects
- Server and storage equipment power distribution
- Communication device internal connections
Procurement Notes
Verify the specific contact plating variant required for your application, as the Minitek Power3.0 series includes both gold and tin options. Confirm that the 3.00mm pitch aligns with your PCB footprint requirements. Ensure the vertical orientation matches your assembly constraints. Check manufacturer documentation for RoHS compliance status and lead-free specifications before finalizing procurement orders.
Selection Notes
Select this component when a robust, high-current vertical header is needed for board-to-board or cable-to-board power applications. The 3.00mm pitch provides ample spacing for higher voltage isolation compared to smaller pitches. Choose this part over signal-only headers due to its 8.5A rating and durable LCP construction designed for thermal stability in demanding environments.
Part Context
This connector belongs to the Minitek Power3.0 family, a specialized line from Amphenol ICC (FCI) focused on power delivery. The series utilizes a 3.00mm pitch to accommodate higher currents while maintaining a compact profile. It is widely used in infrastructure equipment where reliable power transmission is critical.
Replacement Considerations
Direct substitutes include other 12-position, 3.00mm pitch dual-row through-hole headers from the same manufacturer. Verify pin count, pitch, and mounting style compatibility. Cross-reference electrical ratings such as current and voltage to ensure equivalent performance in the target circuit.
