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Product Detailed Parameters
- Description：CONN PWR3.0 VT HEADER
- Series：Minitek® Pwr 3.0
- Mfr：Amphenol ICC (FCI)
- Package：Tray,Tray
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：16
- Number of Rows：2
- Row Spacing - Mating：0.118" (3.00mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole
- Termination：Kinked Pin, Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：0.126" (3.20mm)
- Overall Contact Length：-
- Insulation Height：0.433" (11.00mm)
- Contact Shape：Square
- Contact Finish - Mating：Tin
- Contact Finish Thickness - Mating：100.0µin (2.54µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：Board Guide, Glow Wire Compliant
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：Varies by Wire Gauge
- Voltage Rating：600VAC/DC
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Overview
The Amphenol ICC (FCI) part number 10127721-161GLF is a Minitek Pwr 3.0 series power header connector designed for board-to-board applications. It features a 16-position, dual-row configuration with a 3.00mm pitch and straight through-hole termination. The contacts are gold-plated copper alloy pins rated for 8.5A current and 600VAC voltage. Constructed with black liquid crystal polymer insulation, it operates within a temperature range of -40°C to +105°C.
Feature Summary
- Dual-row power header design with 3.00mm spacing
- Gold-plated male pin contacts for reliable conductivity
- High-temperature resistant liquid crystal polymer housing
- Through-hole solder termination for secure mounting
Applications
- Power distribution in server hardware
- Internal power connections in storage devices
- Telecommunications equipment power interfaces
- Industrial control system board interconnects
Procurement Notes
Verify the specific ordering suffix 'GLF' against the manufacturer's latest datasheet to confirm contact plating thickness and material specifications. Ensure that the selected variant matches the required lead frame dimensions and insulation height for your PCB layout. Cross-reference the RoHS compliance status if environmental regulations apply to your assembly process.
Selection Notes
Select this component when a high-current 3.00mm pitch connection is required between rigid boards. The gold plating offers superior corrosion resistance compared to tin variants. Consider the vertical orientation and dual-row layout for space-constrained power delivery systems where higher amperage capacity is necessary.
Part Context
This connector belongs to the Minitek Pwr 3.0 family, engineered for robust power transmission in compact electronic assemblies. The series provides standardized solutions for high-density power routing in demanding environments. It complements other Minitek products by offering consistent mechanical and electrical performance across various position counts.
Replacement Considerations
Compatible substitutes include 10127721-161LF (tin-plated) or 10127720-161GLF (right-angle version). Verify that alternative part numbers maintain identical pitch, row count, and current ratings before implementation.
