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Product Detailed Parameters
- Description：10127721-185SLF-MTK 3.0 18P DR V
- Series：Minitek® Pwr 3.0
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：18
- Number of Rows：2
- Row Spacing - Mating：0.118" (3.00mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole
- Termination：Kinked Pin, Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：0.126" (3.20mm)
- Overall Contact Length：-
- Insulation Height：0.433" (11.00mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：Flash
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Liquid Crystal Polymer (LCP), Glass Filled, Halogen Free
- Features：Board Guide
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Natural
- Current Rating (Amps)：Varies by Wire Gauge
- Voltage Rating：600VAC/DC
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Overview
The Amphenol ICC (FCI) part number 10127721-185SLF is a Minitek Power3.0 series power-to-the-board header connector. It features an 18-position, dual-row configuration with a 3 mm pitch and straight through-hole mounting style. The male pin contacts are tin-plated copper alloy, rated for 8.5 A current and 600 VAC voltage. The housing is constructed from natural-colored Liquid Crystal Polymer (LCP), providing an insulation resistance of 1 GOhms. The component operates within a temperature range of -40°C to +105°C.
Feature Summary
- High-current power distribution capability via dedicated power-to-the-board design
- Robust mechanical stability provided by LCP housing material and through-hole solder termination
- Dual-row layout optimized for high-density board-level power delivery
Applications
- Server and storage equipment power distribution
- Industrial automation control boards
- Telecommunications infrastructure power modules
Procurement Notes
Verify the specific suffix SLF confirms tin plating rather than gold, as this affects compatibility with mating connectors. Confirm the straight vertical orientation matches the PCB footprint requirements. Ensure the 18-position count aligns with the target circuit design before finalizing procurement orders.
Selection Notes
Select this component when a 3 mm pitch power header is required for high-current applications up to 8.5 A. The tin-plated finish offers a cost-effective solution compared to gold variants while maintaining reliable conductivity. The LCP housing ensures thermal stability suitable for environments reaching 105°C.
Part Context
This connector belongs to the Minitek Pwr 3.0 family, designed specifically for robust power transmission on printed circuit boards. The series utilizes a standardized 3 mm spacing to accommodate higher current loads compared to signal-grade headers. The product line supports various position counts and plating options to suit different industrial and commercial power needs.
Replacement Considerations
Compatible substitutes include other 18-position, 3 mm pitch, dual-row through-hole headers from the same manufacturer series. Verify that replacement parts maintain the identical 8.5 A rating and LCP housing material to ensure consistent thermal and electrical performance.
