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Product Detailed Parameters
- Description：10127721-186SLF-MTK 3.0 18P DR V
- Series：Minitek® Pwr 3.0
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：18
- Number of Rows：2
- Row Spacing - Mating：0.118" (3.00mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole
- Termination：Kinked Pin, Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：0.126" (3.20mm)
- Overall Contact Length：-
- Insulation Height：0.433" (11.00mm)
- Contact Shape：Square
- Contact Finish - Mating：Tin
- Contact Finish Thickness - Mating：100.0µin (2.54µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Liquid Crystal Polymer (LCP), Halogen Free
- Features：Board Guide
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Natural
- Current Rating (Amps)：Varies by Wire Gauge
- Voltage Rating：600VAC/DC
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Overview
The Amphenol ICC (FCI) 10127721-186SLF is a Minitek Pwr 3.0 series power-to-board header connector designed for vertical through-hole mounting. This double-row assembly features 18 positions with a 3 mm pitch and utilizes tin-plated copper contacts. It supports an operating temperature range from -40°C to +105°C and provides an insulation resistance of 1 GOhms, ensuring reliable electrical performance in demanding power distribution applications.
Feature Summary
- Vertical double-row design for high-density power routing
- Through-hole termination for secure board attachment
- Tin-plated contacts for corrosion resistance
- Compatible with Minitek Pwr 3.0 mating systems
Applications
- Server power distribution units
- Telecommunications equipment backplanes
- Industrial control system power modules
- Data center infrastructure boards
Procurement Notes
Verify the specific suffix 'SLF' confirms tin plating rather than gold, as this affects solderability and cost. Confirm availability status directly with Amphenol FCI distributors, as this part may be subject to factory special order requirements or limited regional distribution channels.
Selection Notes
Select this component when a 3 mm pitch vertical header is required for power applications. Ensure the mating socket matches the Minitek Pwr 3.0 series specifications. Verify that the 18-position count aligns with the circuit design requirements and that the through-hole footprint fits the PCB layout constraints.
Part Context
This connector belongs to the Minitek Pwr 3.0 family, engineered for robust power delivery in IT and datacom environments. The series offers various position counts and plating options to suit different current ratings and environmental conditions, providing a standardized solution for board-to-board power connections.
Replacement Considerations
Cross-reference with other 18-position, 3 mm pitch vertical headers from the same manufacturer. Ensure mating compatibility with existing sockets before substitution. Verify that alternative parts meet the same thermal and current rating specifications.
