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The Amphenol ICC (FCI) part number 10127721-201LF is a Minitek Pwr 3.0 series power-to-board header connector designed for high-current applications. It features a dual-row configuration with 20 positions and a 3.00 mm pitch. The connector utilizes male pin contacts made of copper alloy with tin plating, housed in a black thermoplastic insulator rated UL94 V-0. Electrical ratings include an 8.5 A current capacity and 600 VAC voltage rating. It supports through-hole solder termination with a straight mounting style and operates within a temperature range of -40°C to +105°C.
Verify the specific contact plating thickness and insulation material grade against the latest manufacturer datasheet before integration. Confirm that the tin-plated contacts meet the environmental requirements for the intended application environment. Ensure the through-hole soldering process parameters are compatible with the specified operating temperature limits and thermal resistance characteristics.
Select this component when a vertical, dual-row power header with board guiding is required. The 3.00 mm pitch allows for higher current density compared to standard signal connectors. Consider the thermoplastic housing material for cost-effective solutions where LCP is not strictly necessary. Verify that the 8.5 A rating per contact aligns with the circuit design load requirements.
This connector belongs to the Minitek Pwr 3.0 family, which provides standardized power interconnect solutions. It is designed to mate with corresponding socket contacts and housings from the same series. The product line emphasizes reliability in demanding industrial and data center environments, offering various position counts and mounting styles to accommodate diverse PCB layout needs.
Direct replacements must maintain the 3.00 mm pitch, dual-row configuration, and 20-position count. Compatible alternatives may include other Minitek Pwr 3.0 headers with identical electrical ratings and mechanical dimensions. Verify that any substitute part retains the board guide feature and similar thermal performance characteristics.