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Product Detailed Parameters
- Description：10127721-205SLF-MTK 3.0 20P DR V
- Series：Minitek® Pwr 3.0
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：20
- Number of Rows：2
- Row Spacing - Mating：0.118" (3.00mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole
- Termination：Kinked Pin, Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：0.126" (3.20mm)
- Overall Contact Length：-
- Insulation Height：0.433" (11.00mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：Flash
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Liquid Crystal Polymer (LCP), Glass Filled, Halogen Free
- Features：Board Guide
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Natural
- Current Rating (Amps)：Varies by Wire Gauge
- Voltage Rating：600VAC/DC
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Overview
The Amphenol ICC (FCI) 10127721-205SLF is a Minitek Pwr 3.0 series power-to-board header connector designed for vertical through-hole mounting. It features a dual-row configuration with 20 positions and a 3 mm pitch. The contacts are made of copper alloy with tin plating, rated for 8.5 A current and 600 VAC voltage. The housing is constructed from natural Liquid Crystal Polymer (LCP), offering an operating temperature range of -40°C to +105°C and an insulation resistance of 1 GOhms.
Feature Summary
- Vertical through-hole mounting style for direct board integration
- Dual-row layout providing high-density power distribution
- Tin-plated copper contacts ensuring reliable conductivity
- LCP housing material supporting high thermal stability
Applications
- Power distribution in industrial equipment
- Server and storage system backplanes
- Telecommunications infrastructure hardware
- Factory automation control units
Procurement Notes
Verify the specific suffix 'SLF' confirms tin plating rather than gold, as this affects solderability and cost. Confirm the 20-position count matches the design requirement. Check for RoHS compliance status in the latest datasheet revision. Ensure the vertical orientation fits the mechanical clearance constraints of the assembly.
Selection Notes
Select this component when a 3 mm pitch power header is required for vertical installation. The tin finish is suitable for standard lead-free soldering processes. Consider the 8.5 A rating against the total load requirements of the circuit. Verify that the LCP material properties meet the thermal management needs of the application environment.
Part Context
This part belongs to the Minitek Pwr 3.0 family, a line of power connectors by Amphenol FCI. The series is characterized by its 3 mm spacing and robust construction for high-current applications. It is widely used in data communication and industrial sectors where reliable power delivery is critical.
Replacement Considerations
Compatible substitutes within the same Minitek Pwr 3.0 series include other 20-position variants such as 10127721-205NRLF or 10127721-205PLF, depending on the required contact plating finish.
