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Product Detailed Parameters
- Description：CONN PWR3.0 VT HEADER
- Series：Minitek® Pwr 3.0
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：22
- Number of Rows：2
- Row Spacing - Mating：0.118" (3.00mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole
- Termination：Kinked Pin, Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：0.126" (3.20mm)
- Overall Contact Length：-
- Insulation Height：0.433" (11.00mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：15.0µin (0.38µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：Board Guide, Glow Wire Compliant
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：Varies by Wire Gauge
- Voltage Rating：600VAC/DC
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Overview
The Amphenol ICC (FCI) part number 10127721-223GLF is a Minitek Power 3.0 series power-to-board header connector. It features a dual-row configuration with 22 positions and a 3 mm pitch. Designed for through-hole mounting, the connector utilizes male pin contacts made of copper alloy with gold plating. The housing is constructed from black Liquid Crystal Polymer (LCP), providing high thermal stability and electrical insulation. Rated for 8.5 A current and 600 VAC voltage, it operates within a temperature range of -40°C to +105°C.
Feature Summary
- Dual-row vertical through-hole header design for secure board-to-board power distribution
- Gold-plated copper alloy contacts ensure reliable conductivity and corrosion resistance
- Black LCP housing offers high heat resistance and structural integrity in demanding environments
Applications
- Server and storage system power distribution modules
- Telecommunications equipment power interfaces
- Industrial control board power connections
Procurement Notes
Verify the specific suffix 'GLF' against official Amphenol documentation to confirm lead-free compliance and exact contact plating thickness. Ensure the 22-position variant matches the required mechanical footprint. Confirm availability status directly with the manufacturer or authorized distributors as stock levels fluctuate.
Selection Notes
Select this component when a 3 mm pitch dual-row power header is required for high-current applications up to 8.5 A. The Minitek Power 3.0 series is suitable for systems needing robust thermal performance and verified UL94 V-0 flammability ratings. Ensure the through-hole soldering process aligns with the specified pin termination style.
Part Context
This connector belongs to the Minitek Power 3.0 family, designed by Amphenol ICC (formerly FCI). The series specializes in high-density power interconnects for infrastructure and industrial markets. These headers provide standardized solutions for distributing power across multiple circuit boards while maintaining signal integrity and mechanical durability.
Replacement Considerations
Compatible substitutes within the same Minitek Power 3.0 series include 10127721-221GLF and 10127721-225NRLF. Verify that alternative part numbers match the 22-position count, 3 mm pitch, and dual-row configuration before implementation.
