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Product Detailed Parameters
- Description：10127721-244GLF-MTK 3.0 DR 24P R
- Series：Minitek® Pwr 3.0
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：24
- Number of Rows：2
- Row Spacing - Mating：0.118" (3.00mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole
- Termination：Kinked Pin, Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：0.126" (3.20mm)
- Overall Contact Length：-
- Insulation Height：0.433" (11.00mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：30.0µin (0.76µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Liquid Crystal Polymer (LCP), Glass Filled, Halogen Free
- Features：Board Guide
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：Varies by Wire Gauge
- Voltage Rating：600VAC/DC
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Overview
The Amphenol ICC (FCI) 10127721-244GLF is a Minitek Power 3.0 series power-to-board header connector designed for vertical through-hole mounting. It features a dual-row configuration with 24 positions and a 3 mm pitch. The contacts are copper alloy pins with 30 microinches of gold plating, rated for 8.5 A current and 600 VAC voltage. The housing is constructed from black liquid crystal polymer (LCP), providing UL94 V-0 flammability rating and an operating temperature range of -40°C to +105°C. Insulation resistance is specified at 1 GOhm.
Feature Summary
- Dual-row vertical through-hole design for high-density power distribution
- Gold-plated copper alloy contacts ensure reliable conductivity and corrosion resistance
- Liquid crystal polymer housing offers high thermal stability and flame retardancy
Applications
- Server and storage equipment power distribution
- Telecommunications infrastructure boards
- Industrial control system power interfaces
Procurement Notes
Verify the specific ordering suffix against the manufacturer's latest datasheet to confirm contact plating thickness and housing color variations. Ensure compatibility with mating power sockets within the Minitek Power 3.0 ecosystem. Check for any recent Product Change Notifications regarding material substitutions or manufacturing location changes before finalizing procurement orders.
Selection Notes
Select this component when a vertical, dual-row power header with a 3 mm pitch is required. Confirm that the board layout supports through-hole soldering and that the 24-position count matches the circuit design. Verify that the 8.5 A per contact rating aligns with the application's current requirements and that the LCP housing material meets the environmental temperature specifications.
Part Context
This part belongs to the Minitek Power 3.0 family, a line of robust power connectors engineered by Amphenol ICC (formerly FCI). The series is characterized by its ability to handle significant current loads in compact form factors, making it suitable for demanding applications where space efficiency and electrical reliability are critical priorities.
Replacement Considerations
Direct substitutes include other 24-position, 3 mm pitch, dual-row vertical headers from the same Minitek Power 3.0 series, such as the 10127721-243NPLF, provided the natural housing color and identical pin configuration are acceptable for the assembly.
