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The Amphenol ICC (FCI) part number 10127819-08222PLF is a Minitek Power4.2 series power-to-board header connector. It features an eight-position configuration with a 4.2mm pitch and two rows of contacts. The component utilizes brass pins with tin plating for reliable electrical performance. Designed for through-hole mounting at a right angle, it incorporates board lock mechanisms to secure the connection. The housing is constructed from black liquid crystal polymer, rated UL94 V-0 for flammability. It supports operating temperatures ranging from -40°C to +105°C and handles up to 600VAC.
Verify the specific suffix PLF indicates tin plating rather than gold when sourcing replacements. Confirm the eight-position count matches the target circuit requirements. Ensure the right-angle through-hole footprint aligns with the PCB layout. Check current ratings against wire gauge specifications. Validate that the black LCP housing meets thermal requirements for the application environment.
Select this connector for applications requiring high voltage isolation and robust mechanical locking. The 4.2mm pitch accommodates higher current loads compared to signal connectors. Tin plating offers cost efficiency for non-corrosive environments. The right-angle form factor aids in space-constrained vertical stacking. Ensure mating components match the header's pin configuration and spacing.
This component belongs to the Minitek Power4.2 family, designed for power delivery in data center and industrial infrastructure. The series emphasizes durability and high current capacity. Amphenol FCI integrates these connectors into broader power distribution solutions. The product line supports various position counts while maintaining consistent interface standards across the series.
Compatible substitutes include other Minitek Power4.2 headers with identical 4.2mm pitch and right-angle through-hole mounting. Verify matching pin counts and tin plating specifications. Ensure equivalent UL94 V-0 rating and temperature range. Cross-reference dimensions for housing width and height compatibility.