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The Amphenol ICC (FCI) part number 10127819-0822GLF is a power-to-board header connector belonging to the Minitek Pwr 4.2 series. It features an eight-position configuration with a 4.20mm pitch and operates at a rated voltage of 600VAC. The component utilizes brass contacts with tin plating, housed in natural nylon insulation. Designed for through-hole right-angle mounting, it supports wire-to-board interconnections and complies with UL94 V-0 flammability standards.
Verify the specific contact plating finish against project requirements, as the Minitek Pwr 4.2 series offers both gold and tin options. Confirm that the 600VAC rating aligns with the system's electrical isolation needs. Ensure the through-hole right-angle form factor fits within the mechanical enclosure constraints. Cross-reference the official datasheet for precise mating force and retention specifications before finalizing the bill of materials.
Select this component when a robust, high-current power header is required for vertical board integration. The 4.20mm pitch accommodates heavier gauge wires compared to signal connectors. Consider the tin-plated variant for cost-sensitive applications where corrosion resistance is managed by the environment. Validate that the 105°C maximum operating temperature meets the thermal profile of the target assembly.
This connector belongs to the Minitek Pwr 4.2 series, designed for demanding power applications. The series provides secure wire-to-board connections with high current carrying capacity. Amphenol ICC (FCI) engineers these components for durability in industrial and data center environments, ensuring stable performance under vibration and thermal cycling conditions typical of modern electronic systems.
Compatible substitutes include other 8-position, 4.20mm pitch right-angle headers from the same manufacturer series, such as 10127819-0612GLF or 10127819-1411GLF, provided the position count matches the design. Verify that alternative parts maintain the 600VAC rating and through-hole termination style to ensure mechanical and electrical compatibility without redesigning the PCB footprint.