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The Amphenol ICC (FCI) part number 10127819-12321PLF is a Minitek Power 4.2 series header connector designed for power-to-board applications. It features a right-angle, through-hole mounting style with a dual-row configuration comprising 12 positions and a 4.2 mm pitch. The contacts are constructed from brass with a tin plating finish. The housing is made of black liquid crystal polymer (LCP), providing UL94 V-0 flammability rating. It operates within a temperature range of -40°C to +105°C and supports a rated voltage of 600V AC.
Verify the specific suffix 'PLF' confirms lead-free compliance and tin plating as documented. Confirm the 12-position count matches the required circuit design. Ensure the right-angle orientation aligns with the mechanical assembly constraints. Cross-reference the manufacturer's latest datasheet for any recent PCN updates regarding material or sourcing changes before finalizing procurement orders.
Select this component when high current capacity and robust thermal performance are required in space-constrained environments. The 4.2mm pitch allows for higher current ratings compared to standard signal headers. The right-angle form factor is suitable for vertical stacking or edge-connecting scenarios where panel depth is limited. Ensure mating connectors match the 4.2mm pitch and dual-row specification.
This connector belongs to the Minitek Power 4.2 family, engineered for demanding power delivery applications. It distinguishes itself from standard signal headers by utilizing larger contact areas and high-performance thermoplastics like LCP. The series is widely adopted in infrastructure hardware requiring durable, high-voltage connections that withstand thermal cycling and mechanical stress over extended operational lifetimes.
Direct substitutes must maintain the 4.2mm pitch, 12-position count, right-angle orientation, and tin-plated brass contacts. Verify that alternative manufacturers offer equivalent LCP insulation and 600V AC ratings. Generic pin headers with different pitches or plating materials may not provide sufficient current carrying capacity or thermal stability.