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The Amphenol ICC (FCI) part number 10127819-24312LF is a Minitek Pwr 4.2 series power connector designed for board-to-board applications. It features a dual-row header configuration with 24 positions and a 4.2 mm pitch. The component utilizes brass contacts with a gold mating finish of 15.0µin thickness, ensuring reliable conductivity. Rated for 9 A current and 600 VAC voltage, it supports an operating temperature range from -40°C to +105°C. The housing is constructed from Liquid Crystal Polymer (LCP), providing high thermal stability and UL94 V-0 flammability rating.
Verify the specific contact plating thickness against the datasheet specification of 15.0µin gold to ensure compatibility with mating requirements. Confirm that the Liquid Crystal Polymer housing meets the thermal management needs of the target application environment. Cross-reference the 24-position count and 4.2 mm pitch with the PCB footprint design to prevent assembly errors during manufacturing.
Select this component when a robust, high-current solution is required for space-constrained power architectures. The 4.2 mm pitch allows for significant current carrying capacity compared to finer pitches. Ensure the right-angle orientation aligns with the mechanical constraints of the enclosure. The LCP material choice is critical for applications involving reflow soldering at elevated temperatures or operation in hot environments.
This connector belongs to the Minitek Pwr 4.2 family, engineered by Amphenol ICC (formerly FCI). The series focuses on delivering high reliability in demanding power delivery scenarios. It complements other Minitek variants by offering a balance between current capacity and physical footprint, serving as a standard interface for modern electronic infrastructure requiring stable power transmission.
Direct substitutes within the same series include variations in position count such as 10127819-2221GLF or 10127819-0612GLF. Verify that any alternative maintains the identical 4.2 mm pitch and dual-row geometry to ensure mechanical interchangeability without redesigning the host board layout.