SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Amphenol ICC (FCI) 10127820-1424LF is a Minitek Power 4.2 series power-to-board header connector designed for vertical surface-mount or through-hole termination. It features an 18-position configuration with a 4.2 mm pitch, supporting dual-row arrangements for high-current applications. The contacts are constructed from brass and finished with 30 microinches of gold plating to ensure reliable conductivity and corrosion resistance. Rated for 9 A per contact, the connector operates within a temperature range of -40°C to +105°C and maintains an insulation resistance of 1 GOhm. The natural-colored housing provides structural integrity for board-level power distribution.
Verify the specific suffix 'LCLF' or 'LTLF' against the required termination style and packaging format, as these variants differ in reel versus tray packaging and lead finish specifications. Confirm that the 18-position count matches the target circuit requirements. Ensure the vertical mounting angle aligns with the mechanical assembly constraints before finalizing the order.
Select this component when a robust, high-current power interface is required for board-to-board or cable-to-board connections. The 4.2 mm pitch allows for adequate spacing between high-amperage contacts, reducing thermal stress. Consider the operating temperature range and insulation resistance values to ensure compatibility with the intended environmental conditions and safety standards.
This part belongs to the Minitek Power 4.2 family, a line of connectors engineered for demanding power delivery applications. The series is characterized by its ability to handle significant current loads while maintaining a low profile. Amphenol ICC (FCI) designs these components to meet rigorous reliability standards for industrial and data communication environments.
Cross-reference with other 18-position, 4.2 mm pitch headers from the same manufacturer. Verify that substitute parts match the vertical orientation, dual-row layout, and 9 A current rating. Ensure the replacement offers compatible gold plating thickness and housing material properties.