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Product Detailed Parameters
- Description：CONN HEADER VERT 20POS 4.2MM
- Series：Minitek® Pwr 4.2
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.165" (4.20mm)
- Number of Positions：20
- Number of Rows：2
- Row Spacing - Mating：0.165" (4.20mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole
- Termination：Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：0.138" (3.50mm)
- Overall Contact Length：-
- Insulation Height：0.504" (12.80mm)
- Contact Shape：Square
- Contact Finish - Mating：Tin
- Contact Finish Thickness - Mating：80.0µin (2.03µm)
- Contact Finish - Post：Tin
- Contact Material：Brass
- Insulation Material：Liquid Crystal Polymer (LCP)
- Features：Glow Wire Compliant
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Natural
- Current Rating (Amps)：Varies by Wire Gauge
- Voltage Rating：600VAC/DC
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Overview
The Amphenol ICC (FCI) 10127820-2022LLF is a Minitek Power4.2 series power-to-board connector header. It features a vertical, double-row configuration with 20 positions and a 4.2 mm pitch. The contacts are male pins with tin plating, rated for 9 A current. Designed for surface mount termination, it operates within a temperature range of -40°C to +105°C. The housing is natural-colored, and the component utilizes brass contact material.
Feature Summary
- Vertical double-row header design for board-to-board power distribution
- High-current capability with 9 A rating per contact
- Tin-plated male pin contacts for reliable mating
- Surface mount termination for automated assembly
Applications
- Server and storage equipment power distribution
- Industrial automation power modules
- Telecommunications infrastructure boards
- Heavy equipment control systems
Procurement Notes
Verify the specific ordering suffix LLF against the manufacturer's latest datasheet to confirm contact finish and packaging details. Ensure the vertical orientation and 4.2 mm pitch align with the target PCB footprint. Confirm availability status as supply conditions may vary by region.
Selection Notes
Select this part for applications requiring high current density in a low-profile vertical form factor. The 4.2 mm pitch allows for robust power traces while maintaining compatibility with standard industrial mounting heights. Tin plating offers cost-effective performance for non-corrosive environments.
Part Context
This component belongs to the Minitek Power4.2 family, designed for power-to-board interconnects. The series provides solutions for server, storage, and communication equipment. It supports high-current applications with reliable vertical mounting options.
Replacement Considerations
Cross-reference with other Minitek Power4.2 headers such as 10127820-1022LF or 10127820-1824LCLF. Verify that position count, pitch, and contact finish match the original design requirements before substitution.
