10129186-5120TLF

10129186-5120TLF

  • Description:CONN HEADER VERT 80POS 2MM
  • Series:Minitek®
  • Mfr:Amphenol ICC (FCI)
  • Package:Tray

SKU:a4a9e662ccdc Category: Brand:

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Product Detailed Parameters

  • Description:CONN HEADER VERT 80POS 2MM
  • Series:Minitek®
  • Mfr:Amphenol ICC (FCI)
  • Package:Tray
  • Connector Type:Header
  • Contact Type:Male Pin
  • Pitch - Mating:0.079" (2.00mm)
  • Number of Positions:80
  • Number of Rows:4
  • Row Spacing - Mating:0.079" (2.00mm)
  • Number of Positions Loaded:All
  • Style:Board to Board
  • Shrouding:Shrouded - 4 Wall
  • Mounting Type:Through Hole
  • Termination:Solder
  • Fastening Type:Push-Pull
  • Contact Length - Mating:-
  • Contact Length - Post:0.079" (2.00mm)
  • Overall Contact Length:-
  • Insulation Height:0.339" (8.61mm)
  • Contact Shape:Square
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:10.0µin (0.25µm)
  • Contact Finish - Post:-
  • Contact Material:Copper Alloy
  • Insulation Material:Thermoplastic
  • Features:Pick and Place
  • Operating Temperature:-40°C ~ 125°C
  • Ingress Protection:-
  • Material Flammability Rating:UL94 V-0
  • Insulation Color:Black
  • Current Rating (Amps):1.3A
  • Voltage Rating:200V (AC/DC)

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10129186-5120TLF

Overview

The Amphenol ICC (FCI) part number 10129186-5120TLF is a vertical header connector belonging to the PwrBlade® series. It features an 80-position configuration with a 2.00mm pitch, designed for through-hole termination. The component utilizes gold or GXT™ contact plating and is constructed from black thermoplastic housing material rated UL94 V-0. This connector supports mixed signal and power applications within high-density board-to-board interconnect systems.

Feature Summary

  • Integrates signal and power contacts in a single blade-style system
  • Vertical orientation facilitates compact board stacking
  • Gold or GXT™ surface treatment ensures reliable conductivity

Applications

  • Server backplane interconnects
  • Storage area network (SAN) chassis connections
  • Telecommunications equipment board-to-board links

Procurement Notes

Verify the specific suffix 'TLF' against official Amphenol documentation to confirm lead-free compliance status and exact plating specifications. Ensure mating components match the 2.00mm pitch and blade geometry. Confirm that the vertical height and mounting hole dimensions align with the target PCB layout requirements before finalizing procurement orders.

Selection Notes

Select this component when a high-density vertical interface is required for server or storage architectures. The 2.00mm spacing accommodates mixed signal and power routing efficiently. Verify that the application environment remains within standard operating temperatures and that the vertical profile fits within the system's mechanical constraints without obstructing adjacent components.

Part Context

This connector belongs to the PwrBlade® family, engineered for high-performance computing environments. The series combines signal integrity with robust power delivery capabilities. It is widely utilized in modular infrastructure designs where space efficiency and thermal management are critical for maintaining stable electrical connections across multiple circuit boards.

Replacement Considerations

Consult official Amphenol cross-reference lists for verified substitutes. Generic equivalents may not match the precise blade geometry or locking mechanisms required for proper engagement.

10129186-5120TLF10129186-5120TLF

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