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Product Detailed Parameters
- Description：CONN HEADER SMD 12POS 2.54MM
- Series：EconoStik™ 10129383
- Mfr：Amphenol ICC (FCI)
- Package：Bulk
- Connector Type：Header, Cuttable
- Contact Type：Male Pin
- Pitch - Mating：0.100" (2.54mm)
- Number of Positions：12
- Number of Rows：2
- Row Spacing - Mating：0.100" (2.54mm)
- Number of Positions Loaded：All
- Style：Board to Board or Cable
- Shrouding：Unshrouded
- Mounting Type：Surface Mount
- Termination：Solder
- Fastening Type：Push-Pull
- Contact Length - Mating：0.230" (5.84mm)
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.100" (2.54mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：1.00µin (0.025µm)
- Contact Finish - Post：-
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：-
- Operating Temperature：-55°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：3A
- Voltage Rating：110VDC
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Overview
The Amphenol ICC (FCI) part number 10129383-912001BLF is a surface mount header assembly belonging to the EconoStik series. It features a dual-row configuration with 12 positions and a standard 2.54 mm pitch. The connector utilizes gold-plated contacts for reliable signal transmission and is housed in black thermoplastic insulation rated UL 94 V-0 for flammability. Designed for board-to-board applications, it supports an operating temperature range from -55°C to +105°C and carries a current rating of 3 A at a voltage rating of 110 VDC.
Feature Summary
- Surface mount termination design facilitates automated PCB assembly processes
- Gold contact plating ensures stable electrical performance and corrosion resistance
- Dual-row architecture provides high-density interconnect capability within compact footprints
Applications
- Board-to-board interconnections in industrial instrumentation
- Signal routing in factory automation control systems
- Component interfacing in IoT device architectures
Procurement Notes
Verify the specific ordering suffix against official manufacturer documentation to confirm exact pin count, row configuration, and termination style. Ensure that the selected variant matches the required surface mount footprint and thermal profile specifications for your manufacturing process before finalizing procurement orders.
Selection Notes
Select this component when a low-profile, surface-mount header is required for dense board-to-board connections. The 2.54 mm pitch offers compatibility with standard PCB spacing, while the EconoStik series provides cost-effective reliability for general-purpose electronic assemblies requiring robust mechanical retention.
Part Context
This component belongs to the Amphenol EconoStik family, which specializes in economical yet reliable interconnect solutions. The series is widely utilized across various sectors including industrial equipment, consumer electronics, and telecommunications infrastructure where standardized spacing and dependable connectivity are essential requirements.
Replacement Considerations
Consult official cross-reference lists for verified substitute part numbers. Generic equivalents may differ in contact plating thickness, housing material ratings, or mounting tolerance, potentially affecting long-term reliability and fit.
