10131318-06221G0LF

Overview

The Amphenol ICC (FCI) part number 10131318-06221G0LF is a Power to the Board header from the MinitekPwr 4.2 series. It features a 6-position, 2-row configuration with a 4.2 mm pitch. The connector utilizes copper contacts with 30 microinch gold plating and a black polyamide housing. Rated for 12.5 A current and 600 VAC voltage, it supports through-hole solder termination at a right angle. The operating temperature range spans from -40 °C to +105 °C, with an insulation resistance of 1 GOhms.

Feature Summary

• High-current power delivery capability within a compact board-to-board form factor
• Dual-row vertical or angled mounting options for flexible PCB layout integration
• Gold-plated contact surfaces ensuring reliable conductivity and corrosion resistance

Applications

• Server and storage system power distribution modules
• Telecommunications equipment power supply units
• Industrial control board interconnects requiring high current capacity

Procurement Notes

Verify the specific orientation suffix in the ordering code to confirm whether the component is designed for vertical or right-angle installation. Ensure the selected variant matches the required pin count and row configuration for the target PCB footprint. Confirm that the gold plating thickness meets the application's durability requirements before finalizing procurement orders.

Selection Notes

Select this component when designing systems that require robust power connections with higher current ratings than standard signal headers. The 4.2 mm pitch allows for wider spacing between pins, which can aid in thermal management and manufacturing tolerance. Consider the right-angle profile if space constraints on the PCB surface height are a primary design driver.

Part Context

This connector belongs to the MinitekPwr 4.2 family, engineered for demanding power applications in datacom and industrial sectors. The series provides a balance of high current carrying capacity and mechanical stability. It serves as a critical interface for distributing power across multiple boards in dense electronic assemblies where reliability under thermal stress is essential.

Replacement Considerations

Direct substitutes must match the 4.2 mm pitch, 6-position count, and 2-row structure. Verify compatibility with existing PCB footprints and mating housing dimensions. Alternative components should offer equivalent current ratings and similar environmental operating ranges to ensure seamless integration without redesigning the host board.