10131319-062110PLF

Overview

The Amphenol ICC (FCI) 10131319-062110PLF is a Minitek Power4.2 series power-to-board header designed for vertical through-hole mounting. It features a dual-row configuration with six positions and a 4.2 mm pitch. The connector utilizes copper alloy contacts with tin plating, housed in a natural polyamide insulation body rated for operation between -40°C and +105°C. It supports a current rating of 12.5 A and offers an insulation resistance of 1 GOhms.

Feature Summary

• Vertical dual-row board lock header design
• Tin-plated copper alloy contacts for reliable conductivity
• Polyamide insulation material ensuring high thermal stability

Applications

• Power distribution on main system boards
• High-current signal interconnects in industrial equipment
• Server and storage backplane connections

Procurement Notes

Verify the specific ordering suffix to confirm contact plating and pin count accuracy. Confirm that the vertical through-hole package matches the target PCB footprint requirements. Ensure the tin plating specification aligns with soldering process compatibility and environmental exposure needs before finalizing procurement orders.

Selection Notes

Select this component when a robust vertical power interface with a 4.2 mm pitch is required. The dual-row layout maximizes current capacity within a compact footprint. Verify that the 12.5 A rating meets the circuit load demands and that the operating temperature range covers the intended application environment.

Part Context

This part belongs to the Minitek Power4.2 family, which provides high-current rectangular connectors. The series is engineered for demanding power applications requiring secure mechanical retention and stable electrical performance under thermal stress.

Replacement Considerations

Consult official substitution lists for compatible headers within the same pitch and row configuration. Verify mechanical dimensions and contact plating specifications before replacing.