SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Amphenol ICC (FCI) part number 10131319-12211G0LF is a Minitek Power4.2 series header connector designed for power-to-board applications. It features a 4.2 mm pitch and provides 12 positions arranged in a dual-row configuration. The connector utilizes male pin contacts made of copper with tin plating, housed in a natural-colored casing. It supports a current rating of 12.5 A and operates within a temperature range of -40°C to +105°C. The unit employs vertical through-hole mounting and offers an insulation resistance of 1 GOhms.
Verify the specific ordering suffix requirements directly with the manufacturer or authorized distributors before placing orders. Confirm that the requested variant matches the exact pin count, pitch, and termination style needed for your assembly. Ensure compliance with any non-cancelable or non-returnable policies associated with factory special orders. Cross-reference the datasheet specifications against your system's thermal and electrical constraints to guarantee compatibility.
Select this component when a 12-position, 4.2 mm pitch vertical header is required for power delivery. Evaluate the 12.5 A current rating against peak load requirements to prevent overheating. Consider the tin plating option for cost-effective solutions where gold plating is not strictly necessary. Assess the operating temperature range to ensure suitability for the intended environmental conditions.
This connector belongs to the Minitek Power4.2 family from Amphenol FCI, specialized for power-to-board interconnects. The series is engineered for durability and high current handling in demanding electronic environments. Components in this line typically feature standardized pitches and robust mechanical designs to support reliable performance in server and industrial applications.
Direct substitutes must match the 4.2 mm pitch, 12-position count, dual-row layout, and vertical through-hole termination. Verify that alternative headers maintain equivalent current ratings and contact plating specifications to ensure functional interchangeability without redesigning the PCB footprint.