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The Amphenol ICC (FCI) part number 10131319-2041100LF is a Minitek Power 4.2 series power-to-board connector header. It features a 20-position, dual-row configuration with a 4.2 mm pitch. The contacts are constructed from copper alloy and finished with 30.0 µin (0.76 µm) gold plating on the mating surface, while the post finish is tin. Designed for vertical surface-mount installation, this component supports a current rating of 12.5 A per contact. It operates within a temperature range of -40°C to +105°C and provides an insulation resistance of 1 GOhms.
Verify the specific ordering suffix and packaging configuration directly with Amphenol or authorized distributors, as lead times may vary. Confirm that the tin post finish meets your secondary soldering requirements if applicable. Ensure compatibility with standard surface-mount reflow profiles suitable for the specified operating temperature range before finalizing procurement orders.
Select this component when a high-current, dual-row power interface is required in a compact form factor. The 4.2 mm pitch allows for significant current capacity while maintaining board space efficiency. Verify that the vertical mounting style aligns with your mechanical constraints and that the 12.5 A rating suffices for your circuit load requirements without derating issues.
This connector belongs to the Minitek Power 4.2 family, designed for robust power delivery in demanding environments. The series is widely used in datacom and industrial sectors where reliability under thermal stress is critical. As an FCI product, it integrates into broader ecosystem solutions for server and communication hardware.
No public confirmed substitute part numbers are available in the provided documentation. Cross-reference with other Minitek Power 4.2 variants only if pin count and pitch match exactly.
The contacts are made of copper alloy with a 30.0 µin (0.76 µm) gold plating on the mating surface and a tin post finish.
Yes, it is rated for operation up to +105°C and utilizes UL94 V-0 rated insulation materials for thermal stability.